Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
暫譯: 基板/互連交纏中的功率、熱量、噪聲及信號完整性問題
Yue Ma, Christian Gontrand
- 出版商: CRC
- 出版日期: 2019-03-28
- 售價: $4,980
- 貴賓價: 9.5 折 $4,731
- 語言: 英文
- 頁數: 248
- 裝訂: Hardcover
- ISBN: 0367023431
- ISBN-13: 9780367023430
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相關分類:
數位影像處理 Digital-image、電路學 Electric-circuits
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商品描述
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
商品描述(中文翻譯)
隨著行動裝置、可穿戴設備和物聯網（IoT）產品的興起，對於晶片內功能的需求和低功耗運作的要求持續增加，3D/2.5D 被視為未來不可避免的發展方向。隨著電路變得越來越複雜，特別是三維電路，必須在許多領域中開發新的見解，包括電氣、熱、噪音、互連和寄生效應。這些領域的交織開始成為我們進入3D奈米電子學的關鍵挑戰。本書旨在發展這一新範式，從許多技術方面的綜合開始。
