Silicon Devices and Process Integration: Deep Submicron and Nano-Scale Technologies (Hardcover)
- 出版商: Springer
- 出版日期: 2009-01-12
- 售價: $1,750
- 貴賓價: 9.8 折 $1,715
- 語言: 英文
- 頁數: 598
- 裝訂: Hardcover
- ISBN: 0387367985
- ISBN-13: 9780387367989
貴賓價: $8,161Bias Temperature Instability for Devices and Circuits (Hardcover)
貴賓價: $1,767BSIM4 and MOSFET Modeling for IC Simulation (Hardcover)
貴賓價: $588IC Layout Basics: A Practical Guide (Paperback)
貴賓價: $2,058Mosfet Modeling for VLSI Simulation: Theory & Practice (Hardcover)
貴賓價: $4,047Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications (Hardcover)
Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author’s industrial and academic lecture notes and reflects years of experience in the development of silicon devices.
- A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;
- State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;
- CMOS-only applications, such as subthreshold current and parasitic latch-up;
- Advanced Enabling processes and process integration.
This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.