Wafer Level 3-D ICS Process Technology

Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif

  • 出版商: Springer
  • 出版日期: 2008-09-19
  • 售價: $9,572
  • 貴賓價: 9.5$9,093
  • 語言: 英文
  • 頁數: 410
  • 裝訂: Hardcover
  • ISBN: 0387765328
  • ISBN-13: 9780387765327

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商品描述

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.