Acoustical Imaging: Techniques and Applications for Engineers (Hardcover)

Woon Siong Gan

  • 出版商: Wiley
  • 出版日期: 2012-07-23
  • 售價: $5,670
  • 貴賓價: 9.5$5,387
  • 語言: 英文
  • 頁數: 426
  • 裝訂: Hardcover
  • ISBN: 0470661607
  • ISBN-13: 9780470661604
  • 海外代購書籍(需單獨結帳)

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商品描述

The technology of acoustical imaging has advanced rapidly over the last sixty years, and now represents a sophisticated technique applied to a wide range of fields including non-destructive testing, medical imaging, underwater imaging and SONAR, and geophysical exploration. Acoustical Imaging: Techniques and Applications for Engineers introduces the basic physics of acoustics and acoustical imaging, before progressing to more advanced topics such as 3D and 4D imaging, elasticity theory, gauge invariance property of acoustic equation of motion and acoustic metamaterials. The author draws together the different technologies in sonar, seismic and ultrasound imaging, highlighting the similarities between topic areas and their common underlying theory.

Key features:

  • Comprehensively covers all of the important applications of acoustical imaging.
  • Introduces the gauge invariance property of acoustic equation of motion, with applications in the elastic constants of isotropic solids, time reversal acoustics, negative refraction, double negative acoustical metamaterial and acoustical cloaking.
  • Contains up to date treatments on latest theories of sound propagation in random media, including statistical treatment and chaos theory.
  • Includes a chapter devoted to new acoustics based on metamaterials, a field founded by the author, including a new theory of elasticity and new theory of sound propagation in solids and fluids and tremendous potential in several novel applications.

Covers the hot topics on acoustical imaging including time reversal acoustics, negative refraction and acoustical cloaking.

Acoustical Imaging: Techniques and Applications for Engineers is a comprehensive reference on acoustical imaging and forms a valuable resource for engineers, researchers, senior undergraduate and graduate students.