Advanced Interconnects for ULSI Technology (Hardcover)

Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech

商品描述

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.

Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:

  • Interconnect functions, characterisations, electrical properties and wiring requirements
  • Low-k materials: fundamentals, advances and mechanical  properties
  • Conductive layers and barriers
  • Integration and reliability including mechanical reliability, electromigration and electrical breakdown
  • New approaches including 3D, optical, wireless interchip, and carbon-based interconnects

Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

商品描述(中文翻譯)

尋找銅/低介電常數互連材料對於電腦晶片的持續發展至關重要。雖然銅/低介電常數互連已經發揮了良好的作用,使得超大規模積體電路(ULSI)設備能夠將超過十億個晶體管集成到一個芯片上,但在較小尺寸上增加的電阻和RC延遲已成為影響晶片性能的重要因素。

《先進的ULSI技術互連》專注於可能適合替代材料和方法。它涵蓋了從物理原理到設計、製造、表徵和應用於納米互連的新材料的廣泛主題,並討論了以下內容:

- 互連功能、表徵、電性和布線要求
- 低介電常數材料:基礎知識、進展和機械性質
- 導電層和屏障
- 整合和可靠性,包括機械可靠性、電遷移和電擊穿
- 新方法,包括3D、光學、無線互片和基於碳的互連

本書旨在為研究生和學術界、工業界的研究人員提供對未來電腦晶片發展核心技術的關鍵概述。