Advanced Interconnects for ULSI Technology (Hardcover)

Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech

  • 出版商: Wiley
  • 出版日期: 2012-04-02
  • 售價: $6,800
  • 貴賓價: 9.5$6,460
  • 語言: 英文
  • 頁數: 606
  • 裝訂: Hardcover
  • ISBN: 0470662549
  • ISBN-13: 9780470662540

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Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.

Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:

  • Interconnect functions, characterisations, electrical properties and wiring requirements
  • Low-k materials: fundamentals, advances and mechanical  properties
  • Conductive layers and barriers
  • Integration and reliability including mechanical reliability, electromigration and electrical breakdown
  • New approaches including 3D, optical, wireless interchip, and carbon-based interconnects

Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.