Design and Analysis of Heat Sinks (Hardcover)
            
暫譯: 散熱器的設計與分析 (精裝版)
        
        Allan D. Kraus, Avram Bar-Cohen
- 出版商: Wiley
- 出版日期: 1995-10-03
- 售價: $7,070
- 貴賓價: 9.5 折 $6,717
- 語言: 英文
- 頁數: 424
- 裝訂: Hardcover
- ISBN: 0471017558
- ISBN-13: 9780471017554
- 
    相關分類:
    
      熱力學 Thermodynamics
 
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商品描述
      A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . .
Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.
Other topics covered include:
* Fundamentals of heat transfer
* Thermal modeling of electronic packages
* Mathematical tools for heat-sink analysis and design
* Prevailing thermal transport processes
* Models for a variety of fin geometries
* Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks
* Thermal characterization and optimization of plate-fin heat sinks
Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
      Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.
Other topics covered include:
* Fundamentals of heat transfer
* Thermal modeling of electronic packages
* Mathematical tools for heat-sink analysis and design
* Prevailing thermal transport processes
* Models for a variety of fin geometries
* Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks
* Thermal characterization and optimization of plate-fin heat sinks
Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
商品描述(中文翻譯)
一種強大的方法論,能以低成本和最小的附加質量來產生卓越的熱性能……
這是唯一可用的熱沉設計與分析的綜合性著作。它提供了成功設計和/或選擇電子設備的成本效益熱沉所需的所有理論和實用信息。內容包括對主導熱傳現象的詳細解釋,對幾何複雜的翅片結構的熱模型工具的全面覆蓋,以及對識別熱優化機會的廣泛討論。
其他涵蓋的主題包括:
* 熱傳的基本原理
* 電子封裝的熱模型
* 熱沉分析與設計的數學工具
* 主要的熱傳輸過程
* 各種翅片幾何形狀的模型
* 單翅片、級聯翅片和翅片陣列熱沉的簡單「傳遞函數」關係
* 板翅熱沉的熱特性與優化
《熱沉的設計與分析》是一本完全自足且充滿其他單一來源無法提供的寶貴信息的書籍,對於成熟的熱專家來說是卓越的參考資料,對於機械工程學生的高級熱應用研究生課程來說也是一本優秀的教科書。這本書也可以作為電機工程學生的熱科學教材。

 
     
    
 
     
     
     
    
 
    
 
     
     
     
    
 
     
    
