Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Xing-Chang Wei
- 出版商: CRC
- 出版日期: 2017-05-25
- 售價: $4,980
- 貴賓價: 9.5 折 $4,731
- 語言: 英文
- 頁數: 340
- 裝訂: Hardcover
- ISBN: 1138033561
- ISBN-13: 9781138033566
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商品描述
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.
This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.