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商品描述
Build the microchips of the future with this revolutionary new information transfer technology
Advancements in high-performance computing have continually demanded for progresses in disruptive technological research and innovations. Moore's Law has pushed the Very Large Scale Integration (VLSI) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials.
VLSI Interconnect Technology with Artificial Plasmonics introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips.
In VLSI Interconnect Technology with Artificial Plasmonics, readers will also find:
- A cutting-edge new approach supported by pioneering research
- Detailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validation
- Roadmap to future technological development in the branch of artificial plasmonics
VLSI Interconnect Technology with Artificial Plasmonics is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics.
商品描述(中文翻譯)
**利用這項革命性的資訊傳輸技術建造未來的微晶片**
高效能計算的進步不斷要求顛覆性技術研究和創新的進展。摩爾定律推動了超大規模集成（Very Large Scale Integration, VLSI）技術，以指數速度將金氧半場效應晶體管（MOS）裝置壓縮在晶片內，從而超越每平方公分八十億個晶體管的極限。這同時促進了多層次晶片內互連的增長，這些互連由金屬和低介電材料組成。
《VLSI Interconnect Technology with Artificial Plasmonics》介紹了一種通過利用晶片之間在太赫茲頻率下的資訊傳輸能力來改善晶片性能的新方法。這種革命性的電磁波工程稱為偽表面等離子體極化子（spoof surface plasmon polariton），它結合了VLSI和太赫茲互連技術的原則以及人工等離子體技術，以更快的速度傳輸大量數據。這對於追求更快且容量更大的VLSI晶片來說，可能是一項決定性的貢獻。
在《VLSI Interconnect Technology with Artificial Plasmonics》中，讀者還將發現：
- 一種由開創性研究支持的尖端新方法
- 有關THz互連技術發展的基本組件的詳細討論，包括理論、建模、模擬和驗證
- 人工等離子體領域未來技術發展的路線圖
《VLSI Interconnect Technology with Artificial Plasmonics》非常適合從事電子學、電磁學和光學的工程師、研究人員和科學家。
作者簡介
Soumitra R. Joy is an Assistant Professor in the Department of Electrical and Computer Engineering at the University of North Carolina at Charlotte, USA. Before joining academia, he served as a device reliability engineer at Intel Corporation for four years. He earned his Ph.D. in Electrical Engineering from the University of Michigan, Ann Arbor, MI, USA, and is recognized for his research in artificial plasmonics and semiconductor devices.
Pinaki Mazumder, PhD, is a Professor in the Department of Electrical Engineering and Computer Science at the University of Michigan, Ann Arbor, MI, USA. He is a Fellow of both the IEEE and AAAS and internationally recognized for his research in the diverse aspects of VLSI circuits and systemsdesign
作者簡介(中文翻譯)
Soumitra R. Joy 是美國北卡羅來納州夏洛特市的北卡羅來納大學電機與計算機工程系的助理教授。在進入學術界之前，他在英特爾公司擔任了四年的設備可靠性工程師。他在美國密西根州安娜堡的密西根大學獲得電機工程博士學位，並因其在人工等離子體和半導體設備方面的研究而受到認可。
Pinaki Mazumder, PhD, 是美國密西根州安娜堡的密西根大學電機工程與計算機科學系的教授。他是IEEE和AAAS的會士，並因其在VLSI電路和系統設計的多樣化方面的研究而享有國際聲譽。
