Advanced Flip Chip Packaging (Hardcover)

Ho-Ming Tong, Yi-Shao Lai, C.P. Wong

  • 出版商: Springer
  • 出版日期: 2011-07-14
  • 售價: $8,200
  • 貴賓價: 9.5$7,790
  • 語言: 英文
  • 頁數: 560
  • 裝訂: Hardcover
  • ISBN: 1441957677
  • ISBN-13: 9781441957672
  • 下單後立即進貨 (約1週~2週)


Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.