PCB Trace and Via Currents and Temperatures:: The Complete Analysis
暫譯: PCB 路徑與通孔電流與溫度：完整分析

This is the first edition. A second edition of the book has been released that you might prefer. Search Amazon.com for it or refer to www.ultracad.com for more information. Finally! For the first time, here is a complete, thorough analysis of the relationships between PCB trace (and via) currents and trace temperatures. All in one place! Brooks has been looking at these relationships since the mid '90s. And he has assembled 20-plus years of knowledge into these pages. Starting with a historical background, this book covers: (a) PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces; (b) The IPC curves found in IPC 2152; (c) Equations that fit those curves; (d) Computer simulations that fit those curves and equations; (e) Sensitivity analyses showing what happens when we vary the environment (adjacent traces and planes, changing trace lengths, thermal gradients, etc.); (f) Via temperatures and what determines them; (g) Via current densities; (h) Fusing issues, what happens when traces are overloaded, and (g) a chapter showing how unevenly traces heat, even at low temperatures. There are supplemental chapters or appendices on measuring the thermal conductivity of dielectrics and measuring the resistivity of copper traces (and why many prior attempts have been doomed to failure.) And there is even a chapter on whether Industrial CT Scanning might replace microsections for measuring trace parameters. Never before has such a thorough compendium been available, especially so conveniently.