System-in-Package RF Design and Applications

Michael P. Gaynor

  • 出版商: Artech House
  • 出版日期: 2006-10-31
  • 定價: $4,360
  • 售價: 9.5$4,135
  • 貴賓價: 9.0$3,928
  • 語言: 英文
  • 頁數: 221
  • 裝訂: Hardcover
  • ISBN: 158053905X
  • ISBN-13: 9781580539050

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Description:

Heres the first book that offers practical guidance on SiP (system-in-package) RF design techniques for todays complex wireless devices. It offers a solid grasp of RF components together with state-of-the-art packaging strategies to help you meet todays increasingly demanding requirements for reliability, manufacturability, RF performance, size, and cost. This comprehensive how to? resource explains design rules for laminate and LTCC modules and the trade-offs between them, and presents expert working guidelines to help you make smart IC partitioning decisions early in the design phase.

You get full details on embedded filter designs with RF architecture trade-offs for performance and cost. Other passive circuitry is also detailed like couplers, BALUNs, and antenna switches that can be integrated in the package to save cost and space. The book addresses advanced techniques enabling the integration of all wireless functions into one module, and explores up-and-coming embedded passive and embedded die capability pointing the way to ever-smaller modules with marginal cost impact. Moreover, you find details on shielding for a complete licensed transceiver.? Real-world?issues pertaining to RX architecture with VCO grounding, power control EVM effects, and modeling round out the coverage, and plentiful examples illustrate capabilities, constraints, trade-offs, and options at every step. Supported by over 100 illustrations, this book is indispensable in tackling the challenges of RF system integration in a module package.

Table of Contents:

Introduction ?Electronics Packaging History. SiP Definition and Justification. SoC versus SiP. SiP Designer Requirements. RF Test.

LTCC versus Laminate ?General LTCC Design Rules and Substrates. Laminate General Design Rules and Substrates. LTCC versus Laminate. Thermal Characteristics.

Assembly Process ?Assembly Process Flow. Die Attach. Die Protect/Encapsulation Characteristics.

TX and RX Architecture ?Transceiver Architectures. Digital Modulation EVM Definition and Relationship?to BER. Transmitter Circuit Block Impairments and Relationship to EVM.

RF Components ?Discrete Components Modeling. Smith Chart Practical Knowledge. Embedded Inductor and Capacitor Structures & Relationship to Model and Q.

Filters ?General Filter Discussion. SAW, BAW, Crystal Filters, Laminate, and Ceramic Filter Performance. Distributed Filters. Other Structures.

Other Passive Circuits ?BALUNs. Matching and Bias Lines. PIN Diode Antenna Switches. Other Passive Structures.

Active Circuit Design ?LNA Design. PA Design.

Oscillators and Synthesizers ?Oscillator Design. Oscillator Phase Noise. PPL/Synthesizer. Synthesizer Phase Noise and Lock Time.

Advanced Packaging Techniques (Designs) ?Shielding. Antenna. Embedded Passives. Integrated Passive Network (IPN). Overmold LTCC. Overmold as Underfill for Flip Chip. Discrete Components and IPNs in Leadframe.

Advanced RF Design Techniques ?Shortwave Coupler. LNA Design. PA Linearization Techniques. Broadband Matching. PIN Diode Antenna Switches.