Systems-Level Packaging for Millimeter-Wave Transceivers
暫譯: 毫米波收發器的系統級封裝

Bozanic, Mladen, Sinha, Saurabh

Systems-Level Packaging for Millimeter-Wave Transceivers
  • 出版商: Springer
  • 出版日期: 2019-04-04
  • 售價: $4,040
  • 貴賓價: 9.5 折 $3,838
  • 語言: 英文
  • 頁數: 277
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 3030146898
  • ISBN-13: 9783030146894

    • 海外代購書籍(需單獨結帳)

相關主題

商品描述

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.


商品描述(中文翻譯)

本書提供了一種系統層級的方法來做出毫米波收發器的封裝決策。在電子學中，封裝形成了集成電路或單個設備與整個電子系統之間的橋樑，涵蓋了兩者之間的所有技術。為了能夠做出有根據的封裝決策，研究人員需要理解廣泛的方面，包括：傳輸頻帶的概念、天線與傳播、集成與離散封裝基板、材料與技術、互連、被動與主動元件，以及各種封裝和封裝方法的優缺點，還有封裝層級的建模與模擬。封裝還需要考慮系統層級的測試，以及相關的測試和生產成本，並降低成本。本書經過同行評審，通過探討上述概念並將其應用於毫米波範疇及其所提供的獨特機會，為現有的學術文獻做出了貢獻。

作者簡介

Mladen Bozanic (Ph.D, University of Pretoria), is a Senior IC Design Engineer responsible for mixed-mode design and design-for-test at Azoteq, South Africa and part-time researcher at the Department of Electrical and Electronic Engineering Science, University of Johannesburg. He is a Specialist Editor of South African Institute of Electrical Engineers (SAIEE) Africa Research Journal for the field of microelectronics and has authored or co-authored over 25 peer-reviewed contributions.

Prof Saurabh Sinha obtained his B.Eng, M.Eng, and Ph.D. degrees in Electronic Engineering from the University of Pretoria. As an established researcher, rated by the National Research Foundation (NRF), he has authored or co-authored over 110 publications in peer-reviewed journals and at international conferences. Prof Sinha is the Deputy Vice-Chancellor: Research and Internationalisation, University of Johannesburg. Prof Sinha served the 2014-2015 IEEE Board of Director and as IEEE Vice-President: Educational Activities.

作者簡介(中文翻譯)

Mladen Bozanic（南非比勒陀利亞大學博士），是南非Azoteq公司的高級IC設計工程師，負責混合模式設計和測試設計，並且是約翰尼斯堡大學電氣與電子工程科學系的兼職研究員。他是南非電氣工程師學會（SAIEE）非洲研究期刊的專家編輯，專注於微電子領域，並且已發表或共同發表超過25篇經過同行評審的論文。

Saurabh Sinha教授在比勒陀利亞大學獲得電子工程的工程學士、工程碩士和博士學位。作為一位已建立的研究者，他獲得了國家研究基金會（NRF）的評價，並在同行評審的期刊和國際會議上發表或共同發表超過110篇論文。Sinha教授是約翰尼斯堡大學的副校長：研究與國際化。Sinha教授曾擔任2014-2015年IEEE董事會成員及IEEE副總裁：教育活動。

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