From 2D to 3D Photonic Integrated Circuits
暫譯: 從2D到3D光子集成電路
Yi, Yasha
- 出版商: Springer
- 出版日期: 2025-06-13
- 售價: $2,170
- 貴賓價: 9.5 折 $2,062
- 語言: 英文
- 頁數: 208
- 裝訂: Hardcover - also called cloth, retail trade, or trade
- ISBN: 3031915070
- ISBN-13: 9783031915079
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相關主題
商品描述
The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.
This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.
商品描述(中文翻譯)
光子學與電子學的整合已經改變了現代科技的面貌。在這場革命的最前沿是光子集成電路（Photonic Integrated Circuits, PICs）的發展。PICs 歷史上根植於傳統的 2D 製造過程，這些過程源自電子集成電路，但 PICs 轉向了 3D 配置，引入了影響可擴展性、效率和性能的新設計理念。電子電路與光子電路的融合帶來了獨特的挑戰和巨大的機會。
本書介紹了光子集成電路及其從 2D 到 3D PICs 的過渡。接著描述了 3D PICs 的設計和製造技術，以及相關的挑戰和解決方案。最後，還討論了 3D 光子學的應用、新興技術和行業前景。
作者簡介
Dr. Yi is currently Fellow of Optica (Optical Society of America), a full Professor of Electrical Engineering, was the founding EECE PhD program chair and Provost faculty fellow, University of Michigan, Dearborn campus, and LNF, University of Michigan, Ann Arbor campus. He received the Ph.D. degree from the Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, and was a Post-Doctoral Associate with the MicroPhotonics Center, Massachusetts Institute of Technology, Cambridge, MA, USA, where he was involved in research on integrated nano optoelectronic devices and systems. He had extensive research experiences with the Los Alamos National Laboratory, and the 3M Corporate Research Laboratory. He is also a Professor Affiliate with the Microsystems Technology Laboratory at MIT. He has authored more than hundreds of top journal papers, edited four book/book chapters, and holds 33 issued patents (17 U.S. patents and 16 international patents). He has led several government/industry-funded projects, has been at review panels for NSF, DOE and DOD, and has been a reviewer for leading journals. His research interests are Integrated/Intelligent chips, Renewable energy, Smart micro sensors; Virtual Reality/Augmented Reality, Solid state on-chip Lidar for autonomous driving/UAVs/Robotics; Telecommunications; and Solid state lighting.
作者簡介(中文翻譯)
目前，Yi 博士是美國光學學會（Optica）的研究員，並擔任電機工程的全職教授。他曾擔任密西根大學迪爾伯恩校區電機與計算機工程博士學位課程的創始主席及教務長教員研究員，並在密西根大學安娜堡校區的LNF工作。他在美國麻省理工學院（MIT）獲得博士學位，並曾擔任麻省理工學院微光子學中心的博士後研究員，參與集成納米光電子設備和系統的研究。他在洛斯阿拉莫斯國家實驗室和3M企業研究實驗室擁有豐富的研究經驗。他同時也是麻省理工學院微系統技術實驗室的兼任教授。他已發表超過數百篇頂尖期刊論文，編輯了四本書籍/書章，並擁有33項已授權專利（17項美國專利和16項國際專利）。他曾主導多個政府/產業資助的專案，並參與過國家科學基金會（NSF）、能源部（DOE）和國防部（DOD）的審查小組，並擔任多本領先期刊的審稿人。他的研究興趣包括集成/智能晶片、可再生能源、智能微型感測器；虛擬實境/擴增實境、固態片上激光雷達用於自動駕駛/無人機/機器人；電信；以及固態照明。
