Electronic Materials Innovations and Reliability in Advanced Memory Packaging
暫譯: 先進記憶體封裝中的電子材料創新與可靠性
Gan, Chong Leong, Huang, Chen Yu
相關主題
商品描述
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
商品描述(中文翻譯)
本書提供了關於先進記憶體裝置封裝中可靠性及電子材料創新的全面介紹，涵蓋從元件到系統層級的內容。本書的特點在於不僅涵蓋先進封裝材料，還包括記憶體模組和固態硬碟（SSD）中的系統層級封裝與整合部分。
本書對於專業人士和學生來說，是一本極具實用性和應用性的指南，專注於記憶體裝置封裝中的材料可靠性，涵蓋從元件到系統層級的內容。
作者簡介
Dr. Chong Leong, Gan received the B.S. degree in Chemical Engineering from National University of Malaysia in 2000, M.S. degree in Chemical Instrumentation in 2003 from University Science Malaysia, and Ph.D. in Nanoelectronic Engineering from University Malaysia Perlis, Malaysia in 2015. He is SMIEEE, Fellow of Institute of Materials Malaysia, Fellow of Malaysian Institute of Chemistry, Fellow of Institute of Physics, UK and Royal Society of Chemistry, UK. Since 2000, he has been a Quality and Reliability MTS with Intel FPGA, Product Engineering Manager with Osram Opto-Semiconductors, Senior R&D Engineering Manager with Western Digital and currently working as Package Characterization Director with Micron Technology Inc. He is recipient of IEEE EPS Distinguish Technical Leadership award in 2021, Emerald Outstanding Reviewer in 2021 ASME JEP Reviewer of the Year in 2022. His research interests including semiconductor packaging reliability, material characterization, nanomaterials, and radiation reliability. He has published more than 70 international journal articles, 1 book with Springer Publisher. CL serves as Editorial boards with more than 30 international journals and with 22 patents issued/ filing in US and China patent offices.
Chen-Yu, Huang received his Ph.D. in the Institute of Mechanical Engineering from Chang Gung University, Taiwan 2012. He has over 10 years of R&D experience in advanced packaging and wafer form assembly process integration. He was the 2.5D and Fan-out assembly project manager in SPIL Corporate R&D center (merged with ASE) from 2012 to 2019. After that, he moved to the Micron Memory Taiwan Co., Ltd. to be a technology development and process integration engineer and focus on hybrid 3D stacking DRAM and HBM (High Band Memory) products. He has authored 1 book with Springer Publishing, more than 30 Journal and conference publications covering warpage, stresses, reliability, failure analysis, material characterization relative topics in electronic packaging investigation.
作者簡介(中文翻譯)
甘宗亮博士於2000年獲得馬來西亞國立大學化學工程學士學位，於2003年獲得馬來西亞科學大學化學儀器碩士學位，並於2015年獲得馬來西亞玻璃大學納米電子工程博士學位。他是SMIEEE、馬來西亞材料學會院士、馬來西亞化學學會院士、英國物理學會院士及英國皇家化學學會院士。自2000年以來，他曾擔任Intel FPGA的品質與可靠性MTS、Osram光電半導體的產品工程經理、西部數據的高級研發工程經理，目前擔任美光科技公司的封裝特性總監。他於2021年獲得IEEE EPS傑出技術領導獎，2021年獲得ASME JEP傑出審稿人獎，並於2022年獲得年度審稿人獎。他的研究興趣包括半導體封裝可靠性、材料特性、納米材料及輻射可靠性。他已發表超過70篇國際期刊文章，並與Springer出版社合著1本書。甘博士擔任超過30本國際期刊的編輯委員會成員，並在美國和中國專利局擁有22項專利的授權/申請。
黃振宇於2012年在台灣長庚大學機械工程研究所獲得博士學位。他在先進封裝和晶圓形式組裝過程整合方面擁有超過10年的研發經驗。他曾擔任SPIL企業研發中心（與ASE合併）2.5D和Fan-out組裝專案經理，任職期間為2012年至2019年。之後，他轉至美光記憶體台灣有限公司擔任技術開發和過程整合工程師，專注於混合3D堆疊DRAM和HBM（高帶寬記憶體）產品。他與Springer出版社合著1本書，並發表超過30篇期刊和會議論文，涵蓋翹曲、應力、可靠性、失效分析、材料特性等與電子封裝研究相關的主題。
