Ion Implantation and Annealing Applications, Science and Technology: Contributions from Iit School, Edition 2024
暫譯: 離子植入與退火應用、科學與技術：來自IIT學校的貢獻，2024年版

Dr. Wilfried Lerch (m) holds a Diploma and a Ph.D. in physics both from Westfälische Wilhelms-Universität Münster (now University of Münster). After working on the basic diffusion mechanism during rapid thermal annealing he joined ast elektronik GmbH in 1994 which later became Mattson Thermal Products GmbH. Until 2008 he was responsible for process technology at customer sites but also for advanced next generation technology and equipment development of lamp-based systems (RTP and Flash). Since 2008 he serves as co-chair of the German Ion Implantation and Annealing User Group and works in the Semiconductor Technology Committee of SEMI Europe. From 2009 to January 2018, he joined centrotherm international AG and was responsible for R&D and technology of all front-end and back-end semiconductor products (furnaces, lamp-based and low-temperature microwave-based equipment as well as soldering tools). Starting 2018 he is working as technology consultant (SkyLark.Solutions) in the field of semiconductor process technology, equipment development as well as process consulting for efficient equipment manufacturing. Additionally in 2020 he joined the Fraunhofer EMFT as head of the Silicon Device and Technology department leading a 200 mm CMOS pilot manufacturing cleanroom.

Dr. Current earned his PhD in Solid-State Physics from Rensselaer Polytechnic Institute (RPI) in 1974. He has held roles in research, process engineering, and technical marketing at organizations such as Applied Materials, Xerox PARC, Trilogy Systems, Signetics/Philips, Cornell University, and RPI. Currently, he is the Chief Technology Officer (CTO) at Silicon Genesis, focusing on proton implant-based layer transfer for advanced packaging and 3DIC stacking. From 2003 to 2007, he was Director of Technical Marketing at Frontier Semiconductor, developing metrology tools for sheet resistance and leakage current. Dr. Current has also been a Visiting Professor at Kyoto University (1990-1992) and National Cheng Kung University, Taiwan (2015). He has authored over 260 publications and multiple patents, co-chaired eight international conferences, and contributed to semiconductor roadmaps (1994-2009). His work includes pioneering ion-beam processing and annealing techniques for IC and photonic devices and co-chairing the SEMI Standards sub-committee for SOI wafers (2000-2002). He was the founding president of the Greater Silicon Valley Ion Implant Users Group (1983), elected to the Bohmische Physical Society (1982), and is an emeritus member of the American Vacuum Society (AVS), with leadership roles in MRS, AVS, ECS, and SPIE.

威爾弗里德·勒希博士（Dr. Wilfried Lerch）擁有德國明斯特大學（Westfälische Wilhelms-Universität Münster，現為明斯特大學）物理學的學士學位和博士學位。在研究快速熱退火過程中的基本擴散機制後，他於1994年加入了ast elektronik GmbH，該公司後來成為Mattson Thermal Products GmbH。在2008年之前，他負責客戶現場的工藝技術，同時也負責基於燈光系統（RTP和Flash）的先進下一代技術和設備開發。自2008年以來，他擔任德國離子植入與退火用戶組的共同主席，並在SEMI Europe的半導體技術委員會工作。從2009年到2018年1月，他加入了centrotherm international AG，負責所有前端和後端半導體產品（爐子、基於燈光和低溫微波的設備以及焊接工具）的研發和技術。自2018年起，他作為技術顧問（SkyLark.Solutions）專注於半導體工藝技術、設備開發以及高效設備製造的工藝諮詢。此外，在2020年，他加入了弗勞恩霍夫EMFT，擔任矽器件與技術部門的負責人，領導200毫米CMOS試點製造的無塵室。

卡倫特博士（Dr. Current）於1974年在倫斯勒理工學院（Rensselaer Polytechnic Institute，RPI）獲得固態物理學的博士學位。他曾在應用材料（Applied Materials）、施樂PARC（Xerox PARC）、三重系統（Trilogy Systems）、西尼特克斯/飛利浦（Signetics/Philips）、康奈爾大學（Cornell University）和RPI等機構擔任研究、工藝工程和技術行銷等職位。目前，他是矽基因（Silicon Genesis）的首席技術官（CTO），專注於基於質子植入的層轉移技術，用於先進封裝和3DIC堆疊。從2003年到2007年，他擔任前沿半導體（Frontier Semiconductor）的技術行銷總監，開發用於薄膜電阻和漏電流的計量工具。卡倫特博士還曾擔任京都大學（1990-1992）和國立成功大學（2015）的訪問教授。他已發表超過260篇論文和多項專利，並共同主持了八個國際會議，對半導體路線圖（1994-2009）做出了貢獻。他的工作包括開創IC和光子器件的離子束處理和退火技術，並共同主持SEMI標準子委員會（2000-2002）負責SOI晶圓。他是大矽谷離子植入用戶組的創始會長（1983年），於1982年當選為波希米亞物理學會（Bohmische Physical Society）成員，並是美國真空學會（AVS）的榮譽會員，在MRS、AVS、ECS和SPIE等組織中擔任領導職位。