Electrical Design of Through Silicon Via

  • 出版商: Springer
  • 出版日期: 2014-05-20
  • 售價: $6,100
  • 貴賓價: 9.5$5,795
  • 語言: 英文
  • 頁數: 280
  • 裝訂: Hardcover
  • ISBN: 940179037X
  • ISBN-13: 9789401790376
  • 下單後立即進貨 (約1週~2週)


Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.