Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration
暫譯: Cu-互連、玻璃及 AI 輔助模擬於晶片和異質整合的應用
Lau, John, Chiang, Kuo-Ning
- 出版商: Springer
- 出版日期: 2026-06-01
- 售價: $8,950
- 貴賓價: 9.5 折 $8,502
- 語言: 英文
- 頁數: 547
- 裝訂: Hardcover - also called cloth, retail trade, or trade
- ISBN: 9819568900
- ISBN-13: 9789819568901
-
相關分類:
電機學 Electric-machinery
海外代購書籍(需單獨結帳)
商品描述
This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as Cu interconnects, glass-core substrate, 3D heterogeneous integration of photonic IC and electronic IC, and combining simulation design with AI technology to effectively apply it to semiconductor packaging.
This book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
商品描述(中文翻譯)
本書專注於設計、材料、流程、製造、品質、可靠性、疲勞、斷裂以及人工智慧（AI）在小晶片和異質整合中的應用。書中涵蓋了原則與工程實踐，並更強調工程實踐。這是通過對多個主要主題進行深入研究來實現的，例如銅互連、玻璃核心基板、光子集成電路（IC）與電子集成電路（IC）的三維異質整合，以及將模擬設計與AI技術結合，從而有效應用於半導體封裝。
本書對於電機工程、機械工程、材料科學及工業工程等領域的研究人員、工程師和研究生均有幫助。
作者簡介
John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 530 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 24 textbooks. John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.
Professor K.N. Chiang received his Ph.D. from the Georgia Institute of Technology in the United States. He is the chair professor at the National Tsing Hua University in Hsinchu, Taiwan. After graduating from Georgia Tech, he worked for four years as a senior researcher at MSC/NASTRAN, a world-famous finite element system. From 2010 to 2013, he served as a general director of the National High-Performance Computing Center, which is the National Strategic Research Center of Taiwan. He has received outstanding research awards from the Ministry of Science and Technology of Taiwan three times and has published more than 450 technical papers in international journals and conference proceedings. He has been granted more than 50 invention patents. Among the major awards Professor Chiang received are the Excellence in Mechanics Award from ASME-EPPD (2022) and the Outstanding Sustained Technical Contribution Award (2020) from IEEE-EPS.
作者簡介(中文翻譯)
約翰·H·劉（John H Lau）擁有超過40年的半導體封裝研發及製造經驗，已發表超過530篇經過同行評審的論文（其中385篇為主要研究者），擁有52項已授權及待授權的美國專利（其中31項為主要發明人），以及24本教科書。約翰是當選的IEEE Fellow、IMAPS Fellow及ASME Fellow，並積極參與產業、學術及社會的會議和研討會，以貢獻、學習和分享。
蔣克南教授（K.N. Chiang）於美國喬治亞理工學院獲得博士學位，目前是台灣新竹國立清華大學的講座教授。自從從喬治亞理工畢業後，他在世界知名的有限元素系統MSC/NASTRAN擔任了四年的高級研究員。從2010年到2013年，他擔任台灣國家高效能計算中心的總經理，該中心是台灣的國家戰略研究中心。他曾三次獲得台灣科技部的傑出研究獎，並在國際期刊及會議論文集中發表超過450篇技術論文。他已獲得超過50項發明專利。蔣教授所獲得的主要獎項包括2022年ASME-EPPD的卓越機械獎及2020年IEEE-EPS的傑出持續技術貢獻獎。
