Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
暫譯: 混合鍵合、高級基板、失效機制及晶片和異質整合的熱管理

John H. Lau was the CTO from July 2019 to July 2021 and has been a Senior Special Project Assistant since August 2021 of Unimicron in Taiwan. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong for 5 years; a specialist of the Industrial Technology Research Institute in Taiwan for 5 years; a Visiting Professor at Hong Kong University of Science and Technology for 1 year; the Director of the Microsystems, Modules, and Components Laboratory at the Institute of Microelectronics in Singapore for 2 years; and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years. He earned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana-Champaign, an M.A.Sc. degree in structural engineering from the University of British Columbia, a second M.S. degree in engineering mechanics from the University of Wisconsin at Madison, and a third M.S. degree in management science from Fairleigh Dickinson University in New Jersey. He also has a B.E. degree in civil engineering from National Taiwan University.

Dr. Xuejun Fan, Regents' Professor of the Texas State University System and Mary Ann and Lawrence E. Faust Endowed Professor at Lamar University, is internationally recognized for his expertise in electronic packaging reliability and modeling. With over 25 years of experience spanning academia and industry, he has held key roles at the Institute of Microelectronics in Singapore, Philips Research in New York, and Intel Corporation in Arizona. Dr. Fan has authored 4 books, 25 book chapters, and over 340 technical papers, holds multiple patents, and provides consultancy for global patent litigation. A sought-after speaker, he has delivered numerous tutorials, workshops, and keynote lectures worldwide. He is an IEEE Fellow, a long-standing IEEE Distinguished Lecturer, and Associate Editor for multiple leading journals, including IEEE Transactions on Components, Packaging and Manufacturing Technology. He has received prestigious honors such as the IEEE EPS Outstanding Sustained Technical Contribution Award (2017), EuroSimE Achievement Award (2023), and consistent recognition among the top 2% of scientists globally by Stanford University. Earlier in his career, he became one of China's youngest full professors at age 27 while at Taiyuan University of Technology, where he held leadership roles and advanced research in applied mechanics. Dr. Fan earned his Ph.D. in Solid Mechanics from Tsinghua University and his B.S. and M.S. from Tianjin University, solidifying his foundation in applied mechanics and reliability engineering.

John H. Lau 於2019年7月至2021年7月擔任台灣Unimicron的首席技術官，並自2021年8月起擔任高級專案助理。在此之前，他在香港的ASM Pacific Technology擔任高級技術顧問5年；在台灣的工業技術研究院擔任專家5年；在香港科技大學擔任訪問教授1年；在新加坡微電子研究所擔任微系統、模組和元件實驗室主任2年；以及在加州的惠普實驗室/安捷倫擔任高級科學家/主要技術專家超過25年。他獲得伊利諾伊大學香檳分校的理論與應用力學博士學位、英屬哥倫比亞大學的結構工程碩士學位、威斯康辛大學麥迪遜分校的工程力學碩士學位，以及新澤西州費爾利迪金森大學的管理科學碩士學位。他還擁有國立台灣大學的土木工程學士學位。

Dr. Xuejun Fan 是德克薩斯州立大學系統的Regents' Professor及拉馬大學的Mary Ann和Lawrence E. Faust捐贈教授，因其在電子封裝可靠性和建模方面的專業知識而享有國際聲譽。擁有超過25年的學術和產業經驗，他曾在新加坡微電子研究所、紐約的飛利浦研究和亞利桑那州的英特爾公司擔任重要職位。Dr. Fan著有4本書、25章書籍和超過340篇技術論文，擁有多項專利，並為全球專利訴訟提供諮詢服務。作為一位受歡迎的演講者，他在全球各地舉辦了無數的教程、研討會和主題演講。他是IEEE Fellow，長期擔任IEEE傑出講者，並擔任多本領先期刊的副編輯，包括IEEE Transactions on Components, Packaging and Manufacturing Technology。他獲得了多項榮譽，如IEEE EPS傑出持續技術貢獻獎（2017年）、EuroSimE成就獎（2023年），並在史丹佛大學的全球科學家前2%中持續獲得認可。在職業生涯早期，他在太原科技大學成為中國最年輕的正教授之一，當時年僅27歲，並在該校擔任領導職位，推進應用力學的研究。Dr. Fan獲得清華大學的固體力學博士學位，以及天津大學的學士和碩士學位，鞏固了他在應用力學和可靠性工程方面的基礎。