Fundamentals of Microsystems Packaging (Paperback)
Rao R. Tummala
- 出版商: McGraw-Hill Education
- 售價: $1,200
- 貴賓價: 9.8 折 $1,176
- 語言: 英文
- 頁數: 967
- 裝訂: Paperback
- ISBN: 007120301X
- ISBN-13: 9780071203012
The only book to teach microsystems packaging--written by the fields leading author
This is the book that engineers, technicians, and students want—the first to teach microsystems packaging from the ground up. Rao Tummala’s one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It’s the only book to do so. This much-needed tool features:
*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*The best way to learn microsystems packaging through self-study or in a classroom—and the most comprehensive on-the-job reference
FROM THE GROUND UP
Chapter 1: Introduction to Microsystems Packaging.
Chapter 2: The Role of Packaging in Microelectronics
Chapter 3: The Role of Packaging in Microsystems.
Chapter 4: Fundamentals of Electrical Package Design.
Chapter 5: Fundamentals of Design for Reliability.
Chapter 6: Fundamentals of Thermal Management.
Chapter 7: Fundamentals of Single Chip Packaging.
Chapter 8: Funamentals of Multichip Packaging.
Chapter 9: Fundamentals of IC Assembly.
Chapter 10: Fundamentals of Water-Level Packaging.
Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded.
Chapter 12: Fundamentals of Optoelectronics.
Chapter 13: Fundamentals of RF Packaging.
Chapter 14: Fundamentals of Microelectromechanical Systems.
Chapter 15: Fundamentals of Sealing and Encapsulation.
Chapter 16: Fundamentals of System-Level PWB Technologies.
Chapter 17: Fundamentals of Board Assembly.
Chapter 18: Fundamentals of Packaging Materials and Processes.
Chapter 19: Fundamentals of Electrical Testing.
Chapter 20: Fundamentals of Package Manufacturing.
Chapter 21: Fundamentals of Microsystems Design for the Environment.
Chapter 22: Fundamentals of Microsstems Reliability.