Fundamentals of Microsystems Packaging (Paperback)

Rao R. Tummala

  • 出版商: McGraw-Hill Education
  • 售價: $1,200
  • 貴賓價: 9.8$1,176
  • 語言: 英文
  • 頁數: 967
  • 裝訂: Paperback
  • ISBN: 007120301X
  • ISBN-13: 9780071203012




The only book to teach microsystems packaging--written by the fields leading author

This is the book that engineers, technicians, and students want—the first to teach microsystems packaging from the ground up. Rao Tummala’s one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It’s the only book to do so. This much-needed tool features:

*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.

*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology

*Easy-to-read schematics and block diagrams

*Fundamental approaches to all system issues

*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others

*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes

*Basics of electrical and reliability testing

*Hundreds of explanatory two-color illustrations

*Self-test problems and solutions in every chapter


*The best way to learn microsystems packaging through self-study or in a classroom—and the most comprehensive on-the-job reference



    Chapter 1: Introduction to Microsystems Packaging.
    Chapter 2: The Role of Packaging in Microelectronics
    Chapter 3: The Role of Packaging in Microsystems.
    Chapter 4: Fundamentals of Electrical Package Design.
    Chapter 5: Fundamentals of Design for Reliability.
    Chapter 6: Fundamentals of Thermal Management.
    Chapter 7: Fundamentals of Single Chip Packaging.
    Chapter 8: Funamentals of Multichip Packaging.
    Chapter 9: Fundamentals of IC Assembly.
    Chapter 10: Fundamentals of Water-Level Packaging.
    Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded.
    Chapter 12: Fundamentals of Optoelectronics.
    Chapter 13: Fundamentals of RF Packaging.
    Chapter 14: Fundamentals of Microelectromechanical Systems.
    Chapter 15: Fundamentals of Sealing and Encapsulation.
    Chapter 16: Fundamentals of System-Level PWB Technologies.
    Chapter 17: Fundamentals of Board Assembly.
    Chapter 18: Fundamentals of Packaging Materials and Processes.
    Chapter 19: Fundamentals of Electrical Testing.
    Chapter 20: Fundamentals of Package Manufacturing.
    Chapter 21: Fundamentals of Microsystems Design for the Environment.
    Chapter 22: Fundamentals of Microsstems Reliability.