Area Array Packaging Processes: for BGA, Flip Chip, and CSP
Ken Gilleo
- 出版商: McGraw-Hill Education
- 出版日期: 2003-10-23
- 售價: $4,340
- 貴賓價: 9.5 折 $4,123
- 語言: 英文
- 頁數: 259
- 裝訂: Hardcover
- ISBN: 0071428291
- ISBN-13: 9780071428293
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相關主題
商品描述
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
Contents :
Introduction
Next
Generation Flip Chip Materials and
Processes
Concepts
Cost
Analysis
High-Throughput FC Processing Using
No-Flow Analysis
Wafer-Level FC
Processing
Analysis of Next Generation FC
Processes
Compression Flow Placement Model &
Analysis
Modeling and Analysis of Chip
Floating
Flip Chip Assembly and
Underfilling
Process
Overview
Substrate
Design
Assembly with Capillary Flow
Underfill
Assembly with Fluxing
Underfills
Water-Applied
Underfills
Reliability
BGA and
CSP Rework
Rework Process
Considerations
Basic Network
Setups
Identification of Process Yield
Problems
Component Reballing
Considerations
Analysis Using X-Ray
Inspection
BGA Assembly
Reliability
BGA and QFP
Comparison
BGA Thermal
Cycling
CBGA Failure
Mechanisms
PBGA Failure
Mechanisms
Shock and Thermal
Cycling
BGA Conclusions for Quality and Reliability
Programs
Die Attach and
Rework
Polymer
Basics
Die-Attach
Materials
Die-Attach Application
Methods
Applications
Properties
Reliability
Rework
Liquid
Encapsulation Equipment and Processes
Encapsulation
Materials
Encapsulation
Methods
Platform Design and
Construction
Dispensing
Head
Needles
Pumps
System
Control
Molding for Area Array
Packages
Molding
Materials
Transfer Molding
Equipment
Molding
Processes
Tooling
Productivity
and
Cost
Reliability
References
Contributors
and Affiliations: