Area Array Packaging Materials: Adhesives, Pastes, and Lead-Free

Ken Gilleo

  • 出版商: McGraw-Hill Education
  • 出版日期: 2003-10-24
  • 售價: $3,760
  • 貴賓價: 9.5$3,572
  • 語言: 英文
  • 頁數: 166
  • 裝訂: Hardcover
  • ISBN: 0071428283
  • ISBN-13: 9780071428286
  • 下單後立即進貨 (約2~4週)



This engineering reference covers the most important assembly processes in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Processes includes vital information necessary for the manufacture of cutting-edge electronics products.


   Chapter 1: Polymer Packaging Materials: Adhesives, Encapsulants, and Underfills
   Chapter 2: Hermetic Packaging Systems: Adhesive and Getter
   Chapter 3: Area Array Solder Spheres, Pastes, and Fluxes
   Chapter 4: Modern Solder and Solder Paste
   Chapter 5: Lead-Free Systems and Process Implications
   Chapter 6: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder?