Wire Bonding in Microelectronics, 3/e (Hardcover)

George Harman

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商品描述

Description

The Industry Standard Guide to Wire Bonding--Fully Updated

The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

  • Ultrasonic bonding systems and technologies, including high-frequency systems
  • Bonding wire metallurgy and characteristics, including copper wire
  • Wire bond testing
  • Gold-aluminum intermetallic compounds and other interface reactions
  • Gold and nickel-based bond pad plating materials and problems
  • Cleaning to improve bondability and reliability
  • Mechanical problems in wire bonding
  • High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds
  • Copper, low-dielectric-constant (Cu/Lo-k) technology and problems
  • Wire bonding process modeling and simulation

商品描述(中文翻譯)

描述

《微電子中的金線焊接》是連接半導體與其封裝的關鍵過程的權威資源。第三版的《微電子中的金線焊接》已經全面修訂,以幫助您應對當今小尺寸和細間距微電子的挑戰。這本權威指南涵蓋了設計、製造和評估使用尖端技術進行的金線焊接的各個方面。除了全面了解焊接技術外,您還將學習如何以極高的產量創建可靠的焊接,測試金線焊接,解決常見的焊接問題,實施分子清潔方法等等。

涵蓋內容包括:
- 超聲波焊接系統和技術,包括高頻系統
- 金線冶金和特性,包括銅線
- 金線焊接測試
- 金鋁金屬間化合物和其他界面反應
- 金和鎳基焊盤鍍層材料和問題
- 清潔以提高焊接性和可靠性
- 金線焊接中的機械問題
- 高產量、細間距、特殊環路、軟基板和極端溫度的金線焊接
- 銅、低介電常數(Cu/Lo-k)技術和問題
- 金線焊接過程建模和模擬