Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Hardcover)
John Lau
- 出版商: McGraw-Hill Education
- 出版日期: 2010-12-22
- 定價: $2,100
- 售價: 9.8 折 $2,058
- 語言: 英文
- 頁數: 640
- 裝訂: Hardcover
- ISBN: 0071753796
- ISBN-13: 9780071753791
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相關分類:
電子商務 E-commerce、電子學 Eletronics
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商品描述
Proven 2D and 3D IC lead-free interconnect reliability techniques
Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of:
- 2D and 3D IC lead-free interconnects
- CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
- Lead-free (SACX) solder joints
- Low-temperature lead-free (SnBiAg) solder joints
- Solder joints with voids, high strain rate, and high ramp rate
- VCSEL and LED lead-free interconnects
- 3D LED and 3D MEMS with TSVs
- Chip-to-wafer (C2W) bonding and lead-free interconnects
- Wafer-to-wafer (W2W) bonding and lead-free interconnects
- 3D IC chip stacking with low-temperature bonding
- TSV interposers and lead-free interconnects
- Electromigration of lead-free microbumps for 3D IC integration
商品描述(中文翻譯)
證實的2D和3D IC無鉛互連可靠性技術
RoHS符合的2D和3D IC互連可靠性探討了PCB組裝、傳統IC封裝、3D IC封裝和3D IC整合中無鉛互連的可靠性問題,並提供了經過測試的解決方案。這本權威指南介紹了最新的電子製造服務(EMS)中二級互連、一級互連封裝組裝以及微球和矽通孔(TSV)互連器的最新可靠性方法和數據。使用本實用資源中的詳細信息,在符合RoHS的項目中設計可靠的2D和3D IC互連。
涵蓋以下可靠性問題:
- 2D和3D IC無鉛互連
- CCGA、PBGA、WLP、PQFP、翻轉芯片、無鉛SAC焊點
- 無鉛(SACX)焊點
- 低溫無鉛(SnBiAg)焊點
- 具有空隙、高應變速率和高斜率的焊點
- VCSEL和LED無鉛互連
- 帶有TSV的3D LED和3D MEMS
- 芯片對晶片(C2W)鍵合和無鉛互連
- 晶片對晶片(W2W)鍵合和無鉛互連
- 具有低溫鍵合的3D IC芯片堆疊
- TSV互連器和無鉛互連
- 用於3D IC整合的無鉛微球的電遷移