Reliability & Failure of Electronic Materials & Devices, 2/e (Paperback)
Milton Ohring , Lucian Kasprzak
- 出版商: Academic Press
- 出版日期: 2014-09-30
- 定價: $1,280
- 售價: 9.5 折 $1,216
- 語言: 英文
- 頁數: 758
- ISBN: 9865666790
- ISBN-13: 9789865666798
下單後立即進貨 (約5~7天)
買這商品的人也買了...
-
PLL 電路設計及應用$390$351 -
Advanced MEMS Packaging (IE-Hardcover)$1,500$1,470 -
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Hardcover)$2,100$2,058 -
BSIM4 and MOSFET Modeling for IC Simulation (Hardcover)$1,860$1,823 -
腐蝕及其防制, 3/e$400$360 -
CMOS Digital Integrated Circuits Analysis & Design, 4/e (IE-Paperback)$1,200$1,140 -
三維 TCAD 模擬 CMOS 奈米電子元件 (3D TCAD Simulation for CMOS Nanoeletronic Devices)$580$551 -
無線通信之射頻被動電路設計, 3/e$290$261 -
The Oxford Solid State Basics (Paperback)$2,090$1,986 -
電路板製造與應用問題改善指南$750$675 -
電路板技術與應用彙編$490$441 -
電路板組裝技術與應用$690$621 -
Berry Phases in Electronic Structure Theory: Electric Polarization, Orbital Magnetization and Topological Insulators (Hardcover)$1,680$1,646 -
Spacetime and Geometry: An Introduction to General Relativity (Hardcover)$1,680$1,646 -
Design of CMOS Phase-Locked Loops: From Circuit Level to Architecture Level (Hardcover)$1,960$1,921 -
圖解智慧工廠：IoT、AI、RPA 如何改變製造業$420$332 -
Medical Instrumentation: Application and Design, 5/e (Hardcover)$1,980$1,940 -
SiC/GaN 功率半導體封裝和可靠性評估技術$534$507 -
材料科學與工程導論 (Callister & Rethwisch: Callister's Materials Science & Engineering, 10/e)$880$862 -
Fundamentals of Modern VLSI Devices, 3/e (美國原版)$2,820$2,764 -
通信產品 PCB 關鍵材料通用評估方法$594$564 -
$709三維集成電路製造技術 -
$653集成電路測試技術 -
$964半導體先進封裝技術 -
半導體製程與整合$620$589
商品描述
<內容簡介>
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.
<章節目錄>
CH 1 An Overview of Electronic Devices and Their Reliability
CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated
CH 3 Defects, Contamination and Yield
CH 4 The Mathematics of Failure and Reliability
CH 5 Mass Transport-Induced Failure
Ch 6 Electronic Charge-Induced Damage
CH 7 Environmental Damage to Electronic Products
CH 8 Packaging Materials, Processes, and Stresses
CH 9 Degradation of Contacts and Packages Interconnections
CH 10 Degradation and Failure of Electro-Optical Materials and Devices
CH 11 Characterization and Failure Analysis of Materials and Devices
CH 12 Future Directions and Reliability Issues
商品描述(中文翻譯)
《電子材料和器件的可靠性與故障》是一本經過充分確立且受到好評的參考書，提供了關於電子器件和電子封裝中使用材料的性能和故障的大部分主題的獨特、單一來源的涵蓋。本書著重於統計預測故障和產品良率，可以幫助設計工程師、製造工程師和品質控制工程師更好地理解導致電子材料故障的常見機制，包括介電擊穿、熱電子效應和輻射損壞。本版新增了在研究實驗室和製造現場獲得的尖端知識，包括塑料和其他新封裝材料、新的測試程序以及對MEMS器件的新涵蓋。
目錄:
第1章 電子器件及其可靠性概述
第2章 電子器件：材料特性決定其操作和製造方式
第3章 缺陷、污染和良率
第4章 故障和可靠性的數學
第5章 質量傳輸引起的故障
第6章 電子電荷引起的損壞
第7章 環境對電子產品的損壞
第8章 封裝材料、工藝和應力
第9章 接觸和封裝互連的退化
第10章 光電材料和器件的退化和故障
第11章 材料和器件的表徵和故障分析
第12章 未來方向和可靠性問題
