Digital Signal Integrity: Modeling and Simulation with Interconnects and Package
Brian Young
- 出版商: Prentice Hall
- 出版日期: 2000-10-19
- 售價: $1,500
- 貴賓價: 9.8 折 $1,470
- 語言: 英文
- 頁數: 560
- 裝訂: Paperback
- ISBN: 0130289043
- ISBN-13: 9780130289049
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商品描述
Description:
For advanced courses in digital design.
This state-of-the-art book provides students with techniques for predicting and achieving target performance levels. Gives students all the theory, practice, general signal integrity issues, and leading-edge experimental techniques they need to accurately model and simulate those interconnections and predict real-world performance.
Table of Contents:
1. Digital Systems and Signaling.
Tradeoffs for
Performance Enhancement. Signaling Standards and Logic Families. Interconnects.
Modeling of Digital Systems.
2. Signal Integrity.
Transmission Lines. Ideal
Point-to-Point Signaling. Nonideal Signaling. Discontinuities. Crosstalk.
Topology. Simultaneous Switching Noise. System Timing. Exercises.
3. Simultaneous Switching Noise.
Origins of SSN.
Effective Inductance. Off-Chip SSN Dependencies. SSN-Induced Skew. Fast
Simulation of Banks. Exercises.
4. Multiport Circuits.
Z-and Y-Parameters.
S-Parameters. Multiport Conversions Between S-, Y-, and Z-Parameters.
Normalization of S-Parameters. Matrix Reductions. Exercises.
5. Inductance.
Summary of an Electromagnetic Result.
Definitions of Inductance. Definition of Mutual Inductance. Calculations with
Neumann's Formula. Definition of Partial Inductance. Formulas for Partial Self-
and Mutual Inductance. Circuit Symbols. Modal Decomposition. Nonuniqueness of
Partial Inductance. Open Loop Modeling. Manipulating the Reference Lead. Model
Reduction. Exercises.
6. Capacitance.
Definition of Capacitance. Capacitance
between Several Conductors. Energy Definition of Capacitance. Frequency
Dependence. Circuit Equations with Capacitance. Modal Decomposition and
Passivity. Reference and Capacitance. Model Reduction. Exercises.
7. Resistance.
Skin Effect. Current Crowding. PEEC
Method. Ladder Networks. Transresistance. Exercises.
8. Measurement of Parasitics.
Measurement Counts.
Impedance Analyzer. Vector Network Analyzer. Time-Domain Reflectometer.
Tradeoffs. Exercises.
9. Lumped Modeling.
Transmission Line Introduction.
Multiconductor Modeling with Two Samples. Multiconductor Modeling with One
Sample. Internal Nodes. Frequency Dependence. Iterative Impedance and Bandwidth.
Model Reduction. Approaches for Specific Interconnects. General Topology.
Multidrop Nets. Exercises.
10. Wideband Modeling.
Transmission Line
Lumped Modeling. Coupled Transmission Lines. Skin Effect Models. Black Box
Modeling. Exercises.
11. Enhancing Signal Integrity.
Differential Signaling. Termination. Multiconductor Termination. Power
Distribution. Advanced Packaging. Exercises.
Appendix A: Solutions to Selected Problems.
Appendix B: Coaxial Peec
Calculator.
Appendix C: Sample Spice SSN Simulations.
Appendix D: Sample
Modal Decomposition Code.
Appendix E: Sample Layer Peeling Code.
Index.
About the Author.