Digital Signal Integrity: Modeling and Simulation with Interconnects and Package
暫譯: 數位信號完整性：連接與封裝的建模與模擬

Description:

For advanced courses in digital design.

This state-of-the-art book provides students with techniques for predicting and achieving target performance levels. Gives students all the theory, practice, general signal integrity issues, and leading-edge experimental techniques they need to accurately model and simulate those interconnections and predict real-world performance.

Table of Contents:

1. Digital Systems and Signaling.
    Tradeoffs for Performance Enhancement. Signaling Standards and Logic Families. Interconnects. Modeling of Digital Systems.

2. Signal Integrity.
    Transmission Lines. Ideal Point-to-Point Signaling. Nonideal Signaling. Discontinuities. Crosstalk. Topology. Simultaneous Switching Noise. System Timing. Exercises.

3. Simultaneous Switching Noise.
    Origins of SSN. Effective Inductance. Off-Chip SSN Dependencies. SSN-Induced Skew. Fast Simulation of Banks. Exercises.

4. Multiport Circuits.
    Z-and Y-Parameters. S-Parameters. Multiport Conversions Between S-, Y-, and Z-Parameters. Normalization of S-Parameters. Matrix Reductions. Exercises.

5. Inductance.
    Summary of an Electromagnetic Result. Definitions of Inductance. Definition of Mutual Inductance. Calculations with Neumann's Formula. Definition of Partial Inductance. Formulas for Partial Self- and Mutual Inductance. Circuit Symbols. Modal Decomposition. Nonuniqueness of Partial Inductance. Open Loop Modeling. Manipulating the Reference Lead. Model Reduction. Exercises.

6. Capacitance.
    Definition of Capacitance. Capacitance between Several Conductors. Energy Definition of Capacitance. Frequency Dependence. Circuit Equations with Capacitance. Modal Decomposition and Passivity. Reference and Capacitance. Model Reduction. Exercises.

7. Resistance.
    Skin Effect. Current Crowding. PEEC Method. Ladder Networks. Transresistance. Exercises.

8. Measurement of Parasitics.
    Measurement Counts. Impedance Analyzer. Vector Network Analyzer. Time-Domain Reflectometer. Tradeoffs. Exercises.

9. Lumped Modeling.
    Transmission Line Introduction. Multiconductor Modeling with Two Samples. Multiconductor Modeling with One Sample. Internal Nodes. Frequency Dependence. Iterative Impedance and Bandwidth. Model Reduction. Approaches for Specific Interconnects. General Topology. Multidrop Nets. Exercises.

10. Wideband Modeling.
      Transmission Line Lumped Modeling. Coupled Transmission Lines. Skin Effect Models. Black Box Modeling. Exercises.

11. Enhancing Signal Integrity.
      Differential Signaling. Termination. Multiconductor Termination. Power Distribution. Advanced Packaging. Exercises.

Appendix A: Solutions to Selected Problems.
Appendix B: Coaxial Peec Calculator.
Appendix C: Sample Spice SSN Simulations.
Appendix D: Sample Modal Decomposition Code.
Appendix E: Sample Layer Peeling Code.

Index.

About the Author.