Signal and Power Integrity - Simplified, 2/e (Hardcover)
暫譯: 信號與電源完整性 - 簡化版, 第2版 (精裝本)
Eric Bogatin
- 出版商: Prentice Hall
- 出版日期: 2009-07-01
- 售價: $3,150
- 語言: 英文
- 頁數: 800
- 裝訂: Hardcover
- ISBN: 0132349795
- ISBN-13: 9780132349796
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商品描述
Description
The #1 Practical Guide to Signal Integrity Design—Now Updated with Extensive New Coverage!
This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition’s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design—topics at the forefront of contemporary electronics design.
Coverage includesUnlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.
- A fully up-to-date introduction to signal integrity and physical design
- How design and technology selection can make or break the performance of the power distribution network
- Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance
- Practical techniques for analyzing resistance, capacitance, inductance, and impedance
- Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement
- Understanding how interconnect physical design impacts signal integrity
- Managing differential pairs and losses
- Harnessing the full power of S-parameters in high-speed serial link applications
- Ensuring power integrity throughout the entire power distribution path
- Realistic design guidelines for improving signal integrity, and much more
商品描述(中文翻譯)
描述
《信號完整性設計的實用指南—現在更新了大量新內容!》
本書匯集了最新的技術,用於發現、修正和避免設計中的信號完整性問題。世界級信號和電源完整性專家 Eric Bogatin 在教授超過五千名工程師的經驗基礎上,系統性地回顧了所有六類信號完整性問題的根本原因,並展示了如何在設計週期的早期將其設計排除。本版的廣泛新內容包括一章全新的 S-參數在信號完整性應用中的應用,以及另一章關於電源完整性和電源分配網路設計的內容—這些主題位於當代電子設計的前沿。
內容包括:
- 完全最新的信號完整性和物理設計介紹
- 設計和技術選擇如何影響電源分配網路的性能
- 探索關鍵概念,如平面阻抗、擴散電感、去耦電容器和電容環路電感
- 分析電阻、電容、電感和阻抗的實用技術
- 通過經驗法則、解析近似、數值模擬和測量來解決信號完整性問題
- 理解互連物理設計如何影響信號完整性
- 管理差分對和損耗
- 在高速串行鏈路應用中充分利用 S-參數的力量
- 確保整個電源分配路徑的電源完整性
- 改善信號完整性的現實設計指南,還有更多內容
與專注於理論推導和數學嚴謹性的書籍不同,本書強調直觀理解、實用工具和工程紀律。設計針對從初學者到專家的電子行業專業人士,將成為確保每次都能正確實現信號完整性設計的寶貴資源。
