Resilient Hybrid Electronics for Extreme/Harsh Environments
暫譯: 極端/惡劣環境下的韌性混合電子技術
Schrand, Amanda, Holmes, MacDonald, Eric
- 出版商: CRC
- 出版日期: 2025-12-26
- 售價: $2,870
- 貴賓價: 9.5 折 $2,727
- 語言: 英文
- 頁數: 172
- 裝訂: Quality Paper - also called trade paper
- ISBN: 0367687658
- ISBN-13: 9780367687656
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相關分類:
電子學 Eletronics
海外代購書籍(需單獨結帳)
相關主題
商品描述
The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation.
The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed "survivable" in environments with high g-forces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer-erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi-axis, multi-material and commercial-off-the-shelf (COTS) integration into user-friendly systems will be a great advancement for the field of printed electronics.
Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma-based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi-material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.
商品描述(中文翻譯)
未來創新技術的成功依賴於擁有共同願景的社群。在這裡,我們提供有關印刷電子技術在惡劣或極端環境中應用的最新技術進展概述。每一章節都揭示了科學和工程的發現,這些發現無疑將推動從概念驗證到設備創建的進展。
本書涵蓋的主要主題包括一些最具前景的材料、方法,以及將印刷材料與商業元件整合的能力,為下一代電子產品奠定基礎,這些產品在高重力、腐蝕、振動和大溫度波動的環境中被稱為「可生存的」。討論了多種材料,這些材料有助於構建堅固的混合電子產品,包括可印刷的導電複合墨水、陶瓷及陶瓷基複合材料、聚合物衍生陶瓷、薄金屬膜、彈性體、焊料和環氧樹脂等。這些材料及相關元件共同用於構建導電路徑、互連、天線、壓力傳感器、溫度傳感器、功率感應裝置、應變傳感器和測量儀器、柔性驅動器、超級電容器、壓電離子元件、電阻器、波導、濾波器、電極、電池、各種檢測器、監測設備、轉換器以及射頻系統和梯度介電或梯度指數(GRIN)結構。新設計將電子元件作為嵌入材料整合到通道、槽和其他方法中,以保護電子元件免受操作環境的極端因素影響,這也被設想為提高其生存能力,同時考慮到所需的更換、重新應用和電源整合的頻率。最後,打印機製造商、軟體提供商和用戶之間的合作,建立多軸、多材料和商業現成(COTS)整合的用戶友好系統,將是印刷電子領域的一大進步。
因此,製造韌性混合電子產品的藍圖由新穎設計組成,這些設計利用了增材製造的進步優勢,並有效地與商業可用元件配對,以生產超越已知限制的設備。作為主要示例,金屬可以通過多種方式沉積到聚合物上,包括氣霧噴射、微分配、電鍍、燒結、真空沉積、超音速束集沉積和基於等離子體的技術等。將這些科學發現創造性地結合到未來的機器人多材料工廠中,可能是印刷電子社群共同追求的可生存設備創建的目標之一。
作者簡介
Dr. Amanda Schrand currently serves as a Senior Engineer and Group Leader for the development of resilient, hybrid additively manufactured electronics at the Munitions Directorate of the Air Force Research Laboratory (AFRL) at Eglin Air Force Base, Florida. She is the Principal Investigator for several Cross Service efforts on 3D printed conformal antennas, frequency selective surfaces, precision electrodes for fiber waveguides, pressure/temperature sensors, strain gauges and high voltage circuits to name a few. Her efforts in ceramics printing innovation have resulted in 2 patents with commercialization and licensing of the technology. Dr. Schrand received her doctoral degree (2007, GPA 4.0) in Materials Science and Engineering from the University of Dayton with the dual support of the Dayton Area Graduate Studies Institute (DAGSI) and the Oak Ridge Associated Universities (ORAU) fellowships. She has fostered a multi-disciplinary career over the past 20 years to gain experience in a range of medical, science and engineering fields. Her written work has been published in many professional venues including Nature Protocols and her article on Additive Manufacturing in Defense is listed as required reading for the Air War College. She has been honored by many individual and team awards including the Team Eglin Women's History Month Trailblazer award recognizing her contributions to leadership and mentorship. She is an active member of the Institute of Electrical and Electronics Engineers (IEEE) professional society and recently began chairing the Women's Panel on Career Development in RF Technology in addition to an International forum on Women in Additive Manufacturing in Italy and proposed collaborative work with the UK.
Mr. Larry (LJ) R. Holmes Jr. is the Executive Director of Research and Engineering at Harrisburg University of Science and Technology, where he leads the development and operation of an Advanced Manufacturing Research Institute. The mission of this academic institute is to create an interdisciplinary forum for bringing materials, processing, and manufacturing together by digital design and innovative manufacturing methods. Mr. Holmes left federal service in 2018 after 15 years at the U.S. Army Research Laboratory (ARL). His final posting at ARL was the Director of Research Partnerships and Communication for the ARL Center for Agile Materials Manufacturing Science (CAMMS). He was also the lead for ARL's Hybrid Manufacturing research portfolio, including the management of materials and manufacturing science programs related to multi-material processing technologies for functional/multi-functional devices. Mr. Holmes is also the Director of Government Relations at nScrypt in Orlando, FL. nScrypt designs and manufactures high-precision micro-dispensing and direct digital manufacturing equipment with unmatched accuracy and flexibility. Mr. Holmes is also the Chief of Manufacturing at the Applied Science and Research Organization of America (ASTRO America). ASTRO America is a non-profit, non-partisan research institute and think tank dedicated to advancing public interest through manufacturing and technology.
Eric MacDonald, Ph.D. is a professor of aerospace and mechanical engineering and Murchison Chair at the University of Texas at El Paso and serves as the Associate Dean of Research and Graduate Studies for the College of Engineering. Dr. MacDonald received his doctoral degree (2002) in Electrical and Computer Engineering from the University of Texas at Austin. He worked in industry for 12 years at IBM and Motorola and subsequently co-founded a start-up specializing in CAD software and the startup was acquired by a firm in Silicon Valley. Dr. MacDonald held faculty fellowships at NASA's Jet Propulsion Laboratory, US Navy Research and was awarded a US State Department Fulbright Fellowship in South America. His research interests include 3D printed multi-functional applications and process monitoring in additive manufacturing with instrumentation and computer vision for improved quality and yield. As a co-founding editor of the Elsevier journal Additive Manufacturing, MacDonald has helped direct the academic journal to have highest impact factor among all manufacturing journals worldwide. He has recently been involved in the commissioning of a second partner journal, Additive Manufacturing Letters, upon which he serves as the Editor-in-Chief. Recent projects include 3D printing of structures such as nano satellites with structurally-embedded electronics - one of which was launched into Low Earth Orbit in 2013 and a replica of which was on display at the London Museum of Science. He has over 100 peer-reviewed publications, dozens of patents, one of which was licensed by Sony and Toshiba from IBM. He is a member of ASME, ASEE, senior member of IEEE and a registered Professional Engineer in the USA state of Texas.
作者簡介(中文翻譯)
Dr. Amanda Schrand 目前擔任佛羅里達州艾格林空軍基地空軍研究實驗室 (AFRL) 彈藥局的高級工程師及小組負責人,專注於開發韌性混合增材製造電子產品。她是多個跨服務計畫的主要研究者,這些計畫包括 3D 列印的符合性天線、頻率選擇性表面、光纖波導的精密電極、壓力/溫度感測器、應變計和高壓電路等。她在陶瓷列印創新方面的努力已獲得 2 項專利,並實現了技術的商業化和授權。Schrand 博士於 2007 年獲得德頓大學材料科學與工程博士學位 (GPA 4.0),並獲得德頓地區研究生學院 (DAGSI) 和奧克里奇聯合大學 (ORAU) 獎學金的雙重支持。在過去的 20 年中,她培養了多學科的職業生涯,積累了醫療、科學和工程領域的經驗。她的著作已在許多專業期刊上發表,包括《Nature Protocols》,她關於國防增材製造的文章被列為空軍戰爭學院的必讀資料。她曾獲得多項個人和團隊獎項,包括表彰她在領導和導師方面貢獻的艾格林團隊女性歷史月開拓者獎。她是電氣和電子工程師學會 (IEEE) 的活躍成員,最近開始擔任無線技術職業發展女性小組的主席,並參加了在意大利舉行的增材製造女性國際論壇,還提議與英國的合作工作。
Larry (LJ) R. Holmes Jr. 先生是哈里斯堡科技大學研究與工程執行董事,負責領導先進製造研究所的開發和運營。該學術機構的使命是通過數位設計和創新製造方法,創建一個跨學科的論壇,將材料、加工和製造結合在一起。Holmes 先生於 2018 年離開聯邦服務,之前在美國陸軍研究實驗室 (ARL) 工作了 15 年。他在 ARL 的最後職位是敏捷材料製造科學中心 (CAMMS) 的研究夥伴關係和溝通主任。他還負責 ARL 的混合製造研究組合,包括管理與功能/多功能設備相關的多材料加工技術的材料和製造科學計畫。Holmes 先生同時也是位於佛羅里達州奧蘭多的 nScrypt 的政府關係主任。nScrypt 設計和製造高精度微分配和直接數位製造設備,具有無與倫比的準確性和靈活性。Holmes 先生還是美國應用科學與研究組織 (ASTRO America) 的製造主管。ASTRO America 是一個非營利、非黨派的研究機構和智庫,致力於通過製造和技術推進公共利益。
Eric MacDonald 博士是德克薩斯州埃爾帕索大學航空航天與機械工程教授及 Murchison 講座教授,並擔任工程學院研究與研究生學習的副院長。MacDonald 博士於 2002 年獲得德克薩斯大學奧斯汀分校的電氣與計算機工程博士學位。他在 IBM 和摩托羅拉的行業工作了 12 年,隨後共同創辦了一家專注於 CAD 軟體的初創公司,該公司被矽谷的一家公司收購。MacDonald 博士曾在 NASA 的噴氣推進實驗室和美國海軍研究所擔任教職,並獲得美國國務院的富布賴特獎學金,前往南美洲進行研究。他的研究興趣包括 3D 列印的多功能應用和增材製造中的過程監控,利用儀器和計算機視覺提高質量和產量。作為 Elsevier 期刊《Additive Manufacturing》的共同創始編輯,MacDonald 幫助該學術期刊成為全球所有製造期刊中影響因子最高的期刊之一。他最近參與了第二本合作期刊《Additive Manufacturing Letters》的創刊工作,並擔任主編。最近的項目包括 3D 列印結構,如結構內嵌電子設備的納米衛星,其中一個於 2013 年發射到低地球軌道,另一個則在倫敦科學博物館展出。他擁有超過 100 篇同行評審的出版物和數十項專利,其中一項由 Sony 和 Toshiba 從 IBM 獲得授權。他是美國機械工程師學會 (ASME)、美國工程教育學會 (ASEE) 的成員,IEEE 的高級會員,並在德克薩斯州註冊為專業工程師。