Mechanics of Solder Alloy Interconnects (Electrical Engineering)

Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau

  • 出版商: Springer
  • 出版日期: 1994-01-31
  • 售價: $8,650
  • 貴賓價: 9.5$8,218
  • 語言: 英文
  • 頁數: 418
  • 裝訂: Hardcover
  • ISBN: 0442015054
  • ISBN-13: 9780442015053
  • 相關分類: 電路學 Electric-circuits
  • 海外代購書籍(需單獨結帳)

商品描述

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.