Microsystem Design (Hardcover)

Stephen D. Senturia



The goal of this book is to bring together into one accessible text the fundamentals of the many disciplines needed by today's engineer working in the field of microelectromechanical systems (MEMS).

The subject matter is wide-ranging: microfabrication, mechanics, heat flow, electronics, noise, and dynamics of systems, with and without feedback. Because it is very difficult to enunciate principles of `good design' in the abstract, the book is organized around a set of Case Studies that are based on real products, or, where appropriately well-documented products could not be found, on thoroughly published prototype work.

The Case Studies were selected to sample a multidimensional space: different manufacturing and fabrication methods, different device applications, and different physical effects used for transduction. The Case Study subjects are: the design and packaging of a piezoresistive pressure sensor, a capacitively-sensed accelerometer, a quartz piezoelectrically-driven and sensed rate gyroscope, two electrostatically-actuated optical projection displays, two microsystems for the amplification of DNA, and a catalytic sensor for combustible gases.

This book is used for a graduate course in `Design and Fabrication of Microelectromechanical Devices (MEMS)' at the Massachusetts Institute of Technology. It is appropriate for textbook use by senior/graduate courses in MEMS, and will be a useful reference for the active MEMS professional.

Each chapter is supplemented with homework problems and suggested related reading. In addition, the book is supported by a web site that will include additional homework exercises, suggested design problems and related teaching materials, and software used in the textbook examples and homework problems.


Foreword. Preface. Acknowledgments. Part I: Getting Started. 1. Introduction. 2. An Approach to MEMS Design. 3. Microfabrication. 4. Process Integration. Part II: Modeling Strategies. 5. Lumped Modeling. 6. Energy-Conserving Transducers. 7. Dynamics. Part III: Domain-Specific Details. 8. Elasticity. 9. Structures. 10. Energy Methods. 11. Dissipation and the Thermal Energy Domain. 12. Lumped Modeling of Dissipative Processes. 13. Fluids. Part IV: Circuit and System Issues. 14. Electronics. 15. Feedback Systems. 16. Noise. Part V: Case Studies. 17. Packaging. 18. A Piezoresistive Pressure Sensor. 19. A Capacitive Accelerometer. 20. Electrostatic Projection Displays. 21. A Piezoelectric Rate Gyroscope. 22. DNA Amplification. 23. A Microbridge Gas Sensor. Appendices: A. Glossary of Notation. B. Electromagnetic Fields. C. Elastic Constants in Cubic Material. References. Ind







前言。前言。致謝。第一部分:入門。1. 簡介。2. MEMS設計方法。3. 微製造。4. 過程整合。第二部分:建模策略。5. 集中建模。6. 節能傳感器。7. 動力學。第三部分:領域特定細節。8. 彈性。9. 結構。10. 能量方法。11. 耗散和熱能領域。12. 耗散過程的集中建模。13. 流體。第四部分:電路和系統問題。14. 電子學。15. 反饋系統。16. 噪音。第五部分:案例研究。17. 封裝。18. 壓阻式壓力傳感器。19. 電容式加速度計。20. 靜電投影顯示器。21. 壓電角速度陀螺儀。22. DNA放大。23. 微橋氣體傳感器。附錄:A. 符號說明。B. 電磁場。C. 立方材料的彈性常數。參考文獻。