Elements of Electromigration: Electromigration in 3D IC technology
Tu, King-Ning, Liu, Yingxia
- 出版商: CRC
- 出版日期: 2024-01-19
- 售價: $3,920
- 貴賓價: 9.5 折 $3,724
- 語言: 英文
- 頁數: 132
- 裝訂: Hardcover - also called cloth, retail trade, or trade
- ISBN: 1032470275
- ISBN-13: 9781032470276
海外代購書籍(需單獨結帳)
相關主題
商品描述
In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.
作者簡介
King-Ning Tu is Professor Emeritus at UCLA and Chair Professor of Materials and Electrical Engineering of City University of Hong Kong. Professor Tu received his BSc degree from National Taiwan University, MSc degree from Brown University, and PhD degree on applied physics from Harvard University in 1960, 1964, and 1968, respectively. Professor Tu is a world leader in the science of thin films, especially in their applications in microelectronic devices, packaging, and reliability.
Dr. Yingxia Liu is an Assistant Professor at City University of Hong Kong. Dr. Liu received her Ph.D. from the Department of Materials Science and Engineering, University of California, Los Angeles in 2016 and her Bachelor's degree from the College of Chemistry and Molecular Engineering, Peking University in 2012.
