Low Dielectric Constant Materials for IC Applications
P. S. Ho , Wei William Lee , J. Leu
- 出版商: Demos Medical Publis
- 出版日期: 2002-11-14
- 售價: $920
- 貴賓價: 9.8 折 $902
- 語言: 英文
- 頁數: 310
- 裝訂: Hardcover
- ISBN: 3540678190
- ISBN-13: 9783540678199
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相關分類:
微電子學 Microelectronics、材料科學 Meterials
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商品描述
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
TABLE OF CONTENTS
Overview on Low Dielectric Constant Materials for IC Applications.- Materials Issues and Characterization of Low-k Dielctric Materials.- Structure and Property Characterization of Low-k Dielectric Porous Thin Films Determined by X-Ray Reflactivity and Small-Angle Neutron Scattering.- Vapor Deposition of Low-k Polymeric Dielectrics.- Plasma Enhanced Chemical Vapor Deposition of FSG and a-C: Low-k Materials.- Porous Organosilicates for ON-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity.- Metal/Polymer Interfacial Interactions.- Diffusion of Metals in Polymers and During Metal-Polymer Interface Formation.- Plasma Etching of Low Dielectric Constant Materials.- Integration of SiLK Semiconductor Dielectric.
商品描述(中文翻譯)
低介電常數材料是微電子設備的重要組成部分。這本全面的書籍涵蓋了最新的低介電常數(低-k)材料技術、薄膜材料表徵、後端互連和封裝應用在微電子領域的整合和可靠性。來自領先的學術和工業實驗室的高度資訊性貢獻提供了關於小於0.18微米製程技術的材料技術的全面信息。主題包括:有機介電材料、無機介電材料、複合介電材料、計量和表徵技術、整合、可靠性。這本書將成為從事介電技術開發、材料科學、聚合物科學和半導體器件和加工的專業人士、科學家、研究人員和研究生的寶貴資源。
目錄:
- 低介電常數材料在集成電路應用中的概述
- 低-k介電材料的材料問題和表徵
- 通過X射線反射率和小角中子散射確定的低-k介電多孔薄膜的結構和性能表徵
- 低-k聚合介電材料的蒸鍍
- FSG和a-C的等離子增強化學氣相沉積:低-k材料
- 用於片上應用的多孔有機矽酸鹽:通過引入多孔性實現介電世代延展性
- 金屬/聚合物界面相互作用
- 金屬在聚合物中的擴散和金屬/聚合物界面形成過程中的擴散
- 低介電常數材料的等離子體刻蝕
- SiLK半導體介電材料的整合