Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
暫譯: 先進半導體封裝與異質整合材料
Shangguan, Dongkai
商品描述
Advanced semiconductor packaging and heterogeneous integration have become a critical area to enable semiconductor devices with high performance, high functional density, high reliability, and low cost. Advancement in semiconductor packaging technology, in turn, depends critically on innovative materials for miniaturization and high I/O density, signal integrity, power integrity, thermal integrity, reliability, as well as manufacturing quality and cost. Sustainability, another important consideration for semiconductor and microelectronics devices and for the industry as a whole, also depends directly on innovative materials solutions.
This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration. Chapter 1 is an overview of semiconductor packaging technologies, outlining the role of materials in various packaging configurations and heterogeneous integration solutions. Chapter 2 reviews substrate and interposer materials (organic, glass, and ceramic) and printed circuit boards. Chapter 3 discusses innovative solder materials for miniaturized interconnects, and Chapter 4 focuses on materials for flexible electronics. Chapter 5 covers materials for thermal management, which is critical for high-performance semiconductor devices, and Chapter 6 covers materials for encapsulation, including underfill, molding compound, conformal coating, etc. Chapter 7 discusses how materials can affect the reliability of semiconductor packaging - particularly for AI and HPC applications, and Chapter 8 provides an overview of materials analysis and testing methodologies and techniques.
This book is aimed at academic and industry researchers as well as industry practitioners. It covers fundamental aspects as well as practical considerations, and it serves as a comprehensive source of the most up-to-date knowledge and a review of the state of the art of the technology and applications for innovative materials for advanced semiconductor packaging and heterogeneous integration.
商品描述(中文翻譯)
先進半導體封裝與異質整合已成為實現高效能、高功能密度、高可靠度及低成本半導體元件的關鍵領域。半導體封裝技術的進展，則高度依賴創新材料，以實現微型化與高 I/O 密度，並確保訊號完整性、電源完整性、熱完整性、可靠度，以及製造品質與成本效益。永續性是半導體與微電子元件及整體產業的另一項重要考量，同樣也直接取決於創新的材料解決方案。
本書全面回顧先進半導體封裝與異質整合所使用創新材料的關鍵主題與最新進展。第 1 章概述半導體封裝技術，說明材料在各種封裝配置與異質整合解決方案中的作用。第 2 章回顧基板與中介層材料（有機材料、玻璃與陶瓷）以及印刷電路板。第 3 章探討用於微型化互連的創新焊料材料；第 4 章則聚焦於軟性電子材料。第 5 章介紹熱管理材料；對高效能半導體元件而言，熱管理至關重要。第 6 章涵蓋封裝材料，包括底部填充材料（underfill）、模封料（molding compound）、共形塗層（conformal coating）等。第 7 章探討材料如何影響半導體封裝的可靠度，尤其是針對 AI 與 HPC 應用；第 8 章則概述材料分析與測試的方法及技術。
本書的對象包括學術界與產業界的研究人員，以及產業實務工作者。內容涵蓋基礎面向與實務考量，可作為創新材料應用於先進半導體封裝與異質整合的完整知識來源，並提供該技術與應用領域最新知識及技術發展現況的全面回顧。
作者簡介
Dongkai Shangguan, IEEE Fellow and IMAPS Fellow, is President of Thermal Engineering Associates, Inc., a provider of application-specific silicon chips for semiconductor thermal characterization. He is also a Strategic Advisor to Indium Corporation, a provider of innovative materials for advanced semiconductor packaging and electronics assembly. Previously, he served as Vice President for Technology and Engineering at Flex (formerly Flextronics), a leading global player for electronics design and manufacturing, and as Vice President at STATS ChipPAC (currently JCET), a leading provider of semiconductor assembly and test services. Early in his career, he held various technical and management responsibilities at Ford and Visteon on automotive electronics.
Shangguan has published several books, authored or co-authored over 200 technical papers, and has been issued 34 U.S. patents. He is an IEEE EPS Distinguished Lecturer and has given numerous keynotes, seminars, and lectures globally.
Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the Daniel C. Hughes Jr. Memorial Award and the William D. Ashman Achievement Award from IMAPS, the President's Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers, among others.
Shangguan earned a BSc in Mechanical Engineering at Tsinghua University, China, an MBA at San Jose State University, and a PhD in Materials at the University of Oxford, UK. He conducted postdoctoral teaching and research at the University of Cambridge and the University of Alabama, and he has served as a guest professor at several universities.
Shangguan is based in San Jose, California, and travels globally in service of the industry.
作者簡介(中文翻譯)
Dongkai Shangguan 為 IEEE Fellow 及 IMAPS Fellow，現任 Thermal Engineering Associates, Inc. 總裁。該公司提供用於半導體熱特性分析的特定應用矽晶片。他同時擔任 Indium Corporation 的策略顧問；該公司提供先進半導體封裝與電子組裝所需的創新材料。此前，他曾任 Flex（前身為 Flextronics）的技術與工程副總裁。Flex 是全球領先的電子產品設計與製造企業；他也曾任 STATS ChipPAC（現為 JCET）副總裁，該公司是半導體封裝與測試服務的領先供應商。在職涯早期，他曾於 Ford 與 Visteon 擔任多項汽車電子領域的技術與管理職務。
Shangguan 已出版多本著作，並撰寫或合著超過 200 篇技術論文，獲頒 34 項美國專利。他是 IEEE EPS Distinguished Lecturer，並在全球各地發表過許多主題演講、研討會演講與專題演講。
Shangguan 曾擔任 iNEMI 董事會、IEEE EPS Board of Governors 及 IPC 董事會成員。他因對業界的貢獻而獲得多項肯定，包括 IEEE EPS 頒發的 Electronics Manufacturing Technology Award 與 Outstanding Sustained Technical Contribution Award、IMAPS 頒發的 Daniel C. Hughes Jr. Memorial Award 與 William D. Ashman Achievement Award、IPC 頒發的 President's Award，以及 Society of Manufacturing Engineers 頒發的 Total Excellence in Electronics Manufacturing Award 等。
Shangguan 於中國 Tsinghua University 取得機械工程理學士學位，於 San Jose State University 取得 MBA，並於英國 University of Oxford 取得材料學博士學位。他曾在 University of Cambridge 與 University of Alabama 從事博士後教學與研究，也曾擔任多所大學的客座教授。
Shangguan 目前居住於加州 San Jose，並為服務業界而在全球各地出差。
