Purple Plague in Microelectronics
暫譯: 微電子學中的紫色瘟疫
Ahmad, Syed Sajid, Blish II, Richard C.
- 出版商: CRC
- 出版日期: 2025-12-01
- 售價: $4,850
- 貴賓價: 9.5 折 $4,608
- 語言: 英文
- 頁數: 132
- 裝訂: Hardcover - also called cloth, retail trade, or trade
- ISBN: 104102424X
- ISBN-13: 9781041024248
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相關分類:
微電子學 Microelectronics
海外代購書籍(需單獨結帳)
相關主題
商品描述
This book is a comprehensive overview of the discoveries in composition, growth and control of gold-aluminum intermetallic compounds in microelectronic interconnects known as purple plague. It focuses on the history of detection, theory, and understanding of the gold-aluminum interface reliability issues.
Purple Plague in Microelectronics presents research on the phenomenon of purple plague from the earliest days to the present. The authors explain intricate scientific aspects to understand cause and effect of this reliability issue in microelectronics in a way that ensures the content is understandable to readers of various educational levels, novice to expert, while satiating the needs of the engineering personnel closely associated with work related to the gold-aluminum interfacial integrity. The discovery of void formation leading to porosity in the purple phase and the resulting joint failure is discussed, along with detailed analyses of the various phases, metallurgy characteristics, and diffusion phenomenon at the gold-aluminum interface. They provide detailed drawings, graphs, charts, models, and tables, which allow easy comprehension of concepts and phenomenon through visual aids. The book explains various methods for evaluating the quality and reliability of wire bond joints, highlighting the relative advantages of each approach. Techniques such as shear testing and bond resistance testing are discussed in detail. It also examines the role of ingredients used in packaging material and the gold wire itself, supported by relevant mathematical models
商品描述(中文翻譯)
這本書全面概述了在微電子互連中被稱為紫色瘟疫的金-鋁金屬間化合物的組成、成長和控制的發現。它專注於檢測歷史、理論以及對金-鋁界面可靠性問題的理解。《微電子中的紫色瘟疫》展示了從最早期到現在的紫色瘟疫現象的研究。作者解釋了複雜的科學方面，以便理解這一微電子可靠性問題的因果關係，確保內容對各種教育程度的讀者（從初學者到專家）都能理解，同時滿足與金-鋁界面完整性相關的工程人員的需求。書中討論了導致紫色相中孔隙形成的空隙生成及其導致的接頭失效，並詳細分析了金-鋁界面的各種相、冶金特性和擴散現象。他們提供了詳細的圖紙、圖表、模型和表格，通過視覺輔助工具使概念和現象易於理解。書中解釋了評估線焊接接頭質量和可靠性的各種方法，突顯了每種方法的相對優勢。詳細討論了剪切測試和焊接電阻測試等技術。它還檢視了包裝材料和金線本身所用成分的角色，並以相關的數學模型作為支持。
本書適合電子組裝工程師、設計工程師、工藝開發工程師、材料科學家、電子行業監督和管理人員，是任何參與金線焊接缺陷控制和可靠性工作的人士的優秀參考資料。
作者簡介
Syed Sajid Ahmad, Ph.D., contributed to quality and reliability enhancement of assembly processes at Intel (1979-1989), especially wire bonding.
Ahmad was involved in semiconductor packaging development at National Semiconductor (1990) and managed quality at GigaBit/TriQuint (1990-1991), a GaAs device company. His major work at Micron Technology (1991-2003) involved, materials enhancement resulting in high reliability products and the development and implementation of advanced packaging of semiconductors. At the Center for Nanoscale Science and Engineering (2003-2015) based at the North Dakota State University, his focus was on enhancing research and manufacturing capabilities at the center in the areas of thin film, thick film, advanced packaging (CSP) and surface mount technology (SMT). At Crossfire Technologies (2018-2019), Ahmad contributed to the development and enhancement of assembly processes. He has over 40 publications and presentations and holds 54 US patents. Dr. Rich C. Blish II is a retired veteran, having worked in semiconductor reliability physics for the entirety of his 45- year career. All of his degrees are from Caltech, Pasadena: BS in Physics; MS and Ph.D in Materials Science in 1967. Rich spent two years with Bell Laboratories, Murray Hill, NJ, on the PicturePhone project; eleven years with Signetics (subsidiary of Phillips), San Jose, CA, doing analytical chemistry; fifteen years with Intel, Santa Clara, CA, in Package Reliability; eleven years with Advanced Micro Devices (AMD), Sunnyvale, CA, as an AMD Fellow in reliability modelling; and was a Spansion Fellow. He has been a prolific author, having written about 60 patents and about 60 peer-reviewed scientific papers winning awards for paper quality at the International Reliability Physics Symposium (IRPS) and the ECTC. The papers (and some book chapters) are on a variety of topics, for example, failure analysis, metallurgy, and the physics of radiation damage. Dr. Blish is a past General Chair and Board Chair for IRPS. He chaired the Sematech RTAB in 2000 and 2007 and has been an Editor of the IEEE Transactions on Device and Materials Reliability.作者簡介(中文翻譯)
Syed Sajid Ahmad, Ph.D. 在英特爾（1979-1989）貢獻於組裝過程的品質和可靠性提升，特別是在線焊接方面。
Ahmad 曾參與國家半導體（National Semiconductor，1990）的半導體封裝開發，並在 GigaBit/TriQuint（1990-1991）這家 GaAs 裝置公司管理品質。他在美光科技（Micron Technology，1991-2003）的主要工作涉及材料的提升，從而實現高可靠性產品，以及半導體的先進封裝開發與實施。在北達科他州立大學的奈米科學與工程中心（Center for Nanoscale Science and Engineering，2003-2015），他的重點是增強該中心在薄膜、厚膜、先進封裝（CSP）和表面貼裝技術（SMT）方面的研究和製造能力。在 Crossfire Technologies（2018-2019），Ahmad 貢獻於組裝過程的開發和提升。他擁有超過 40 篇出版物和演講，並持有 54 項美國專利。Dr. Rich C. Blish II 是一位退休的資深專家，整個 45 年的職業生涯都在半導體可靠性物理領域工作。他的所有學位均來自加州理工學院（Caltech），帕薩迪納：物理學學士；1967 年材料科學碩士及博士。Rich 在貝爾實驗室（Bell Laboratories，紐澤西州穆雷山）工作了兩年，參與 PicturePhone 項目；在 Signetics（飛利浦的子公司，加州聖荷西）工作了十一年，從事分析化學；在英特爾（Intel，加州聖克拉拉）工作了十五年，專注於封裝可靠性；在超微半導體（Advanced Micro Devices，AMD，加州桑尼維爾）工作了十一年，擔任 AMD Fellow，專注於可靠性建模；並曾是 Spansion Fellow。他是一位多產的作者，撰寫了約 60 項專利和約 60 篇經過同行評審的科學論文，並在國際可靠性物理研討會（IRPS）和 ECTC 獲得論文質量獎。這些論文（以及一些書籍章節）涵蓋多種主題，例如故障分析、冶金學和輻射損傷物理。Dr. Blish 曾擔任 IRPS 的總主席和董事會主席。他在 2000 年和 2007 年主持 Sematech RTAB，並擔任 IEEE Transactions on Device and Materials Reliability 的編輯。
