3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Hardcover)

Lih-Tyng Hwang, Tzyy-Sheng Jason Horng

  • 出版商: Wiley
  • 出版日期: 2018-07-18
  • 售價: $1,680
  • 貴賓價: 9.8$1,646
  • 語言: 英文
  • 頁數: 464
  • 裝訂: Hardcover
  • ISBN: 1119289645
  • ISBN-13: 9781119289647
  • 相關分類: 5G

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An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

  • Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
  • Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
  • Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
  • Provides chapter-wise review questions and powerpoint slides as teaching tools