Nanometer CMOS ICs: from Basics to ASICs [Hardcover]

Harry Veendrick

  • 出版商: Springer
  • 出版日期: 2008-07-01
  • 售價: $6,480
  • 貴賓價: 9.5$6,156
  • 語言: 英文
  • 頁數: 730
  • 裝訂: Hardcover
  • ISBN: 1402083327
  • ISBN-13: 9781402083327
  • 相關分類: CMOS
  • 立即出貨(限量) (庫存=1)

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商品描述

CMOS technologies account for almost 90% of all integrated circuits (ICs). This book provides an essential introduction to nanometer CMOS ICs. The contents of this book are based upon several previous publications and editions entitled 'MOS ICs' and 'Deep-Submicron CMOS ICs'.

Nanometer CMOS ICs is fully updated and is not just a copy-and-paste of previous material. It includes aspects of scaling up to and beyond 32nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. In contrast to other works on this topic, the book explores all associated disciplines of nanometer CMOS ICs, including physics, design, technology, yield, packaging, less-power design, variability, reliability and signal integrity. Finally it also includes extensive discussions on the trends and challenges for further scaling. The text is based upon in-house Philips and NXP Semiconductors courseware, which, to date, has been completed by more than 3000 engineers working in a large variety of related disciplines: architecture, design, test, process, packaging, failure analysis and software.

Carefully structured and enriched by in-depth exercises, hundreds of colour figures and photographs and many references, the book is well-suited for the purpose of self-study.

商品描述(中文翻譯)

CMOS技術佔了近90%的集成電路(IC)。這本書提供了對奈米CMOS IC的基本介紹。本書的內容基於之前幾本出版物和版本,名為「MOS ICs」和「Deep-Submicron CMOS ICs」。

《奈米CMOS ICs》是全面更新的,並不僅僅是之前材料的複製和粘貼。它包括了從32nm CMOS技術及其以上的尺寸縮小方面的設計。它清楚地描述了基本的CMOS操作原理,並深入探討了設計實施和應用的各個方面。與其他相關主題的著作不同,本書探討了奈米CMOS ICs的所有相關學科,包括物理學、設計、技術、產量、封裝、低功耗設計、變異性、可靠性和信號完整性。最後,它還廣泛討論了進一步尺寸縮小的趨勢和挑戰。本書的內容基於飛利浦和NXP半導體公司的內部課程,迄今已有超過3000名從事相關學科的工程師完成了這些課程,包括架構、設計、測試、工藝、封裝、故障分析和軟件。

本書結構嚴謹,並通過深入的練習、數百個彩色圖片和照片以及許多參考資料來豐富內容,非常適合自學使用。