Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Zhang, G. Q., Ernst, L. J., De Saint Leger, O.
- 出版商: Springer
- 出版日期: 2010-12-03
- 售價: $4,390
- 貴賓價: 9.5 折 $4,171
- 語言: 英文
- 頁數: 192
- 裝訂: Quality Paper - also called trade paper
- ISBN: 1441948732
- ISBN-13: 9781441948731
-
相關分類:
微電子學 Microelectronics
海外代購書籍(需單獨結帳)
相關主題
商品描述
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are: - The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation /LIST Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Main areas covered are: -