Unraveling Bluetooth Low Energy Audio: Stretching the Limits of Interoperable Wireless Audio with Bluetooth Next-Generation Audio Standards

Bhalla, Himanshu, Haggai, Oren

  • 出版商: Apress
  • 出版日期: 2021-04-05
  • 售價: $1,460
  • 貴賓價: 9.5$1,387
  • 語言: 英文
  • 頁數: 224
  • 裝訂: Quality Paper - also called trade paper
  • ISBN: 1484266579
  • ISBN-13: 9781484266571
  • 相關分類: Bluetooth

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商品描述

Explore how Bluetooth Low Energy (LE) has transformed the audio landscape, from music streaming to voice recognition applications. This book describes the rationale behind moving to LE audio, the potential power savings, and how various specifications need to be linked together to develop a final end product.

LE Audio is a natural development of the Bluetooth audio standard. The standard is spread across more than a dozen different specifications, from application profiles, down to the core transports in both Host part and Controller part. You'll see how this new architecture of the Bluetooth audio stack defines a LE Audio stack from the Core Controller to the Host Protocols, and Profiles.

You'll also learn how to free yourself from wires and charging. LE Audio introduces a new audio compression codec called LC3 (Low Complexity Communication Codec), which covers sampling rates for the full range of voice and media application at high fidelity, low complexity and low bit-rate and is ideal for new applications - such as voice assistance and gaming.

Unraveling Bluetooth Low Energy Audio provides full context to anyone who is curious to learn about the new LE Audio technology.

What You'll Learn

  • Understand the advantages of LE audio over current standards

  • Describe the overall Bluetooth LE audio stack and its various blocks
  • Enable LE audio with the Core Controller specification
  • See how an end-to-end application works its through the LE audio ecosystem
  • Examine how LE Audio addresses current and future trends in interoperable wireless audio

Who This Book Is For
The target audience for this book are developers, manufacturers, students, lecturers, teachers, technology geeks, platform integrators, and entrepreneurs.

作者簡介

Himanshu Bhalla is a Software Architect in the Client Computing Group (CCG) inside Intel Corporation and is based out of Bengaluru, India. He is a Computer Science graduate of IIT-BHU (Indian Institute of Technology - (BHU), Varanasi) and has over 17 years of experience in Software architecture, design and development. He spent most of his career in the Bluetooth and wireless technology domain. During the start of his career he was involved with a startup (Impulsesoft) which was behind one of the world's first Bluetooth combined (HF and A2DP) audio headsets in the market. He later worked with Broadcom where he was the architect for Bluetooth Software on Samsung Tizen DTV and received a key achievement award for it. He also contributed to Wi-Fi Direct Services (WFDS) standard and represented Broadcom in the Wi-Fi Alliance. In Intel, he contributed to Wi-Fi Serial Bus (WSB) standard and was instrumental in developing MAUSB (Media Agnostic USB) Software technology. He was a key contributor to Bluetooth Low Energy Audio standard and was editor of multiple critical specifications (ASCP, BAP, etc.). He received the prestigious "Outstanding New Contributor of the year" award for this work from the Chairman of Board of Directors of Bluetooth SIG during the Working Group Summit in Kirkland in 2018 - this award is based on anonymous voting by the members of the Bluetooth SIG Working Groups. For this, he was featured on the Bluetooth SIG website and also on Bluetooth SIG LinkedIn account, and this was written about him - "The procedures which he defined are a corner stone for LE audio". He was also interviewed inside Intel and his interview was featured in the company's "Inside Blue" portal. He also represents Intel in Bluetooth Architecture Review Board (BARB) and has provided feedback to over 20 specifications spanning across various Bluetooth SIG Working Groups (e.g. Mesh, ATA, GA, etc.). He is also a prolific inventor and has 4 patents granted and 4 more filed with the USPTO. He considers this book as an attempt to give back to the technology and a means to show gratitude to everyone involved in development of this standard.

Oren Haggai is a system architect in the wireless connectivity solutions group at Intel Israel, focusing on Bluetooth technology. He has over 20 years of experience working on various wireless products and standards. Over the years, he contributed to the specification development from early Bluetooth Core 0.7, 0.9, 1.0B, 1.1, 2.1, 4.1 and 5.2, until the latest state of the Bluetooth specifications. He began working on Bluetooth in 1999, while studying at the Technion university, Israel Institute of Technology, where he received a BSc in Computer and Software Engineering from the EE faculty. While at the university he integrated a Bluetooth stack for handheld PCs and phone form factors and instructed students in various Bluetooth projects. He designed and implemented a wireless local information system based on Bluetooth for the EE faculty at the Technion. He later joined a startup (Mobilian) in 2001 which integrated the world's first single chip Wi-Fi/Bluetooth coexistence solution which was the basis of the PTA 3-wire standard. While at Mobilian he designed the world's first wireless desktop system, enabling the concurrent operation of Bluetooth mouse, keyboard, A2DP music, file transfer, while co-running and co-exist with Wi-Fi networks. He joined Intel in 2003, as part of Mobilian's acquisition by Intel. At Intel he designed and developed Bluetooth solutions for phones and PCs, and a quality of service based dynamic connection manager for cellular WiMAX networks. He wrote system requirements for Bluetooth Low energy for Intel products and became a Bluetooth training champion at Intel, providing training to multiple discipline teams from RF, analog, HW, VLSI, firmware software and validation. He designed numerous MAC and PHY modules in Wi-Fi and in Bluetooth, which are driving a few generations of Intel Wi-Fi/Bluetooth wireless solutions in today's Intel based PCs. He is a member in the following Bluetooth SIG working groups: Audio Telephony and Automotive Working Group (ATAWG), Hearing Aids Working Group (HAWG), Generic Audio Working Group (GAWG) and Core Spec Working Group (CSWG). He contributed to every aspect of the LE Audio specifications in Controller, Host and Codec. He initiated the 0.7 version of the LE Audio stream control specifications, while defining the basic stream control quality of service procedures and coined a few popular LE Audio terms such as PAC (Published Audio Capability) and BASE (Broadcast Audio Source Endpoint). He holds several patents in the area of wireless communications. He sees the latest development in the Bluetooth specifications as an exciting era and a renaissance of the Bluetooth technology, and wishes to spread that knowledge to a wider audience.