High-Bandwidth Memory Interface (Paperback)
暫譯: 高帶寬記憶體介面 (平裝本)
Chulwoo Kim
- 出版商: Springer
- 出版日期: 2013-11-18
- 售價: $3,000
- 貴賓價: 9.5 折 $2,850
- 語言: 英文
- 頁數: 96
- 裝訂: Paperback
- ISBN: 3319023802
- ISBN-13: 9783319023809
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商品描述
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.
商品描述(中文翻譯)
本書提供了記憶體介面設計在架構和電路層面的最新進展概述。內容涵蓋信號完整性與測試、TSV 介面、高速串行介面（包括均衡、ODT、前強調）、寬 I/O 介面（包括串擾、偏移消除以及時鐘生成與分配）。此外，還涵蓋了進一步帶寬增強的趨勢。
