Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: from Particle Scale to Feature, Die and Wafer Scales
暫譯: 亞微米集成電路製造的化學機械平坦化整合模型：從顆粒尺度到特徵、晶片和晶圓尺度

Description

This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP.

Table of contents

Introduction.- Review of CMP Modeling.- Material Removal Mechanism in CMP.- Effects of Abrasive Size Distribution in CMP.- Material Removal Regions in CMP.- One and Semi-Two Dimensional Feature- and Die-Scale Modeling for the Damascene Process.- Three-Dimensional Feature-Scale Modeling of CMP.- Wafer-Scale Modeling of CMP.- Summary and Future work.