Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: from Particle Scale to Feature, Die and Wafer Scales
暫譯: 亞微米集成電路製造的化學機械平坦化整合模型:從顆粒尺度到特徵、晶片和晶圓尺度

Jianfeng Luo, David Dornfeld

  • 出版商: Springer
  • 出版日期: 2004-10-07
  • 售價: $1,600
  • 貴賓價: 9.8$1,568
  • 語言: 英文
  • 頁數: 311
  • 裝訂: Hardcover
  • ISBN: 354022369X
  • ISBN-13: 9783540223696
  • 下單後立即進貨 (約5~7天)

商品描述

Description

This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP.

Table of contents

Introduction.- Review of CMP Modeling.- Material Removal Mechanism in CMP.- Effects of Abrasive Size Distribution in CMP.- Material Removal Regions in CMP.- One and Semi-Two Dimensional Feature- and Die-Scale Modeling for the Damascene Process.- Three-Dimensional Feature-Scale Modeling of CMP.- Wafer-Scale Modeling of CMP.- Summary and Future work.

商品描述(中文翻譯)

**描述**

本書是加州大學伯克利分校在化學機械平坦化(CMP)研究領域發展的產物。其重點在於過程模型這一重要領域,而這一領域並未跟上CMP應用的巨大擴展。書中專門探討了開發具有足夠細節的模型,以便評估和權衡過程輸入和參數,從而評估對生產質量或數量的影響。過程中機械元素的重要角色也包含在這種「整合模型」中。本書的目標是介紹一些被忽視的過程機械方面的背景,包括墊片表面形貌和磨料顆粒。「整合模型」在尋求過程優化、消耗品設計以及重要的減少CMP對環境影響方面特別有用。

**目錄**

引言 - CMP建模回顧 - CMP中的材料去除機制 - CMP中磨料粒徑分佈的影響 - CMP中的材料去除區域 - Damascene過程的一維和半二維特徵及模具尺度建模 - CMP的三維特徵尺度建模 - CMP的晶圓尺度建模 - 總結與未來工作。