Area Array Package Design: Techniques in High Density Electronics

Ken Gilleo, Ken Gilleo

  • 出版商: McGraw-Hill Professional
  • 出版日期: 2003-10-24
  • 定價: $4,140
  • 售價: 9.2$3,820
  • 貴賓價: 8.8$3,629
  • 語言: 英文
  • 頁數: 204
  • 裝訂: Hardcover
  • ISBN: 0071428275
  • ISBN-13: 9780071428279

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商品描述

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.

         

    Preface
   Chapter 1: Introduction to Electronic Packaging
   Chapter 2: Trends/Drivers in the Electronics Manufacturing Industry
   Chapter 3: Area Array Packaging
   Chapter 4: Stacked/3D Packages
   Chapter 5: Compliant IC Packaging
   Chapter 6: Flip Chip Technology
   Chapter 7: Options in High-Density Part Cleaning
   Chapter 8: MEMS Packaging and Assembly Challenges
   Chapter 9: Ceramic Ball and Column Grid Array Overview
    INDEX