Area Array Package Design: Techniques in High Density Electronics

Ken Gilleo, Ken Gilleo

  • 出版商: McGraw-Hill Education
  • 出版日期: 2003-10-24
  • 售價: $4,570
  • 貴賓價: 9.5$4,342
  • 語言: 英文
  • 頁數: 204
  • 裝訂: Hardcover
  • ISBN: 0071428275
  • ISBN-13: 9780071428279
  • 海外代購書籍(需單獨結帳)



This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.


   Chapter 1: Introduction to Electronic Packaging
   Chapter 2: Trends/Drivers in the Electronics Manufacturing Industry
   Chapter 3: Area Array Packaging
   Chapter 4: Stacked/3D Packages
   Chapter 5: Compliant IC Packaging
   Chapter 6: Flip Chip Technology
   Chapter 7: Options in High-Density Part Cleaning
   Chapter 8: MEMS Packaging and Assembly Challenges
   Chapter 9: Ceramic Ball and Column Grid Array Overview