Area Array Package Design: Techniques in High Density Electronics
暫譯: 區域陣列封裝設計：高密度電子技術技巧

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.

Contents：         

    Preface
   Chapter 1: Introduction to Electronic Packaging
   Chapter 2: Trends/Drivers in the Electronics Manufacturing Industry
   Chapter 3: Area Array Packaging
   Chapter 4: Stacked/3D Packages
   Chapter 5: Compliant IC Packaging
   Chapter 6: Flip Chip Technology
   Chapter 7: Options in High-Density Part Cleaning
   Chapter 8: MEMS Packaging and Assembly Challenges
   Chapter 9: Ceramic Ball and Column Grid Array Overview
    INDEX