Through-Silicon Vias for 3D Integration (Hardcover) (三維整合的通孔硅通道)
John H. Lau
- 出版商: McGraw-Hill Education
- 出版日期: 2012-10-11
- 售價: $5,940
- 貴賓價: 9.5 折 $5,643
- 語言: 英文
- 頁數: 512
- 裝訂: Hardcover
- ISBN: 0071785140
- ISBN-13: 9780071785143
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商品描述
A comprehensive guide to TSV and other enabling technologies for 3D integration
Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.
This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.
Coverage includes:
- Nanotechnology and 3D integration for the semiconductor industry
- TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing
- TSVs: mechanical, thermal, and electrical behaviors
- Thin-wafer strength measurement
- Wafer thinning and thin-wafer handling
- Microbumping, assembly, and reliability
- Microbump electromigration
- Transient liquid-phase bonding: C2C, C2W, and W2W
- 2.5D IC integration with interposers
- 3D IC integration with interposers
- Thermal management of 3D IC integration
- 3D IC packaging
商品描述(中文翻譯)
一份關於 TSV 及其他 3D 整合技術的綜合指南
由一位在電子產業擁有超過 30 年經驗的專家撰寫,Through-Silicon Vias for 3D Integration 提供有關 TSV、晶圓薄化、薄晶圓處理、微凸點及組裝、以及熱管理技術的前沿資訊。書中討論了高性能、高密度、低功耗、寬頻寬及小型化電子產品的應用。
本書為活躍於 3D 整合研究與開發的專業人士、希望掌握 3D 整合問題解決方法的人士,以及需要低功耗、寬頻寬設計和高良率製造流程的互連系統需求者,提供了及時的進展總結。
內容涵蓋:
- 半導體產業的奈米技術與 3D 整合
- TSV 蝕刻、介電層、阻隔層及種子層沉積、銅電鍍、化學機械平坦化 (CMP) 及銅顯露
- TSV 的機械、熱及電性行為
- 薄晶圓強度測量
- 晶圓薄化及薄晶圓處理
- 微凸點、組裝及可靠性
- 微凸點電遷移
- 瞬態液相鍵合:C2C、C2W 及 W2W
- 2.5D IC 整合與中介層
- 3D IC 整合與中介層
- 3D IC 整合的熱管理
- 3D IC 封裝