Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
Zhang, Hengyun, Author, Faxing Che, Lin, Tingyu
- 出版商: Woodhead Publishing
- 出版日期: 2019-11-15
- 售價: $9,710
- 貴賓價: 9.5 折 $9,225
- 語言: 英文
- 頁數: 434
- 裝訂: Quality Paper - also called trade paper
- ISBN: 0081025327
- ISBN-13: 9780081025321
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相關分類:
電路學 Electric-circuits
海外代購書籍(需單獨結帳)
商品描述
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
