Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition

Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems

A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.

Additionally, the author:

• Addresses various cross-discipline issues in the design of electromechanical products
• Provides a solid foundation for heat transfer, vibration, and life expectancy calculations
• Identifies reliability issues and concerns
• Develops the ability to conduct a more thorough analysis for the final design
• Includes design tips and guidelines for each aspect of electronics packaging

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition

explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, - electrical or quality engineering.

成功估計電子系統的熱力學和機械特性

《實用電子封裝指南：熱力學和機械設計與分析，第三版》是一本為新手或需要複習的從業人員提供的權威指南，它幫助讀者了解系統故障並幫助識別可能發生故障的領域。這本書專為機械、電氣或質量工程師設計，涵蓋了電子封裝中的工程問題，並提供了設計新系統或疑難解答現有系統所需的基礎知識。最新版增加了兩個關於聲學和可靠性基礎的章節，並提供了更多關於電氣故障和原因的信息。它還包括了理解熱傳遞、震動和振動的工具。

此外，作者還：

- 解決了電機產品設計中的各種跨學科問題
- 為熱傳遞、振動和壽命預期計算提供了堅實的基礎
- 確定了可靠性問題和關注點
- 培養了進行更全面分析的能力
- 提供了每個電子封裝方面的設計技巧和指南

《實用電子封裝指南：熱力學和機械設計與分析，第三版》解釋了電子產品設計的機械和熱流體方面，並提供了對電子封裝設計問題的基本理解。該書深入介紹了材料，並描述了系統設計指南，同時也確定了機械、電氣或質量工程從業人員的可靠性問題。

Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations. Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM - used as a teaching tool for individuals with cognitive disabilities.

Ali Jamnia喜歡教學和指導初級工程師。他的主要專長是電機機械系統的設計和開發。此外，他還喜歡使用數值近似和電腦模擬來進行各種工程問題的分析。Jamnia博士自1990年代初以來一直專注於電子封裝問題，並自1995年起參與開發創新的電子系統，以幫助身體或認知障礙的人。事實上，他的主要成就是開發了一種專門的電腦系統，稱為Learning StationTM，用作認知障礙人士的教學工具。