Antenna-In-Package Technology and Applications

Liu, Duixian, Zhang, Yueping

  • 出版商: Wiley
  • 出版日期: 2020-03-31
  • 售價: $3,980
  • 貴賓價: 9.5$3,781
  • 語言: 英文
  • 頁數: 416
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 1119556635
  • ISBN-13: 9781119556633

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商品描述

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging

Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors--well-known experts on the topic--explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging-based AiP, and 3D-printing-based AiP.

The book includes a detailed discussion of the surface laminar circuit-based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book:

- Includes a brief history of antenna-in-package technology
- Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN)
- Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance

Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

作者簡介

DUIXIAN LIU, PHD, is a researcher and master inventorat IBM at Thomas J. Watson Research Center. He is a co-editor of the Wiley title Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits and Springer title Handbook of Antenna Technologies. He served as an Associate Editor of the IEEE Transactions on Antennas and Propagation for nine years and a Guest Editor for the IEEE Transactions on Antennas and Propagation onfour Special Issues related to mm-wave antenna designs. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012. He is a Fellow of IEEE.

YUEPING ZHANG, PhD, is a Professor of Electronic Engineering at Nanyang Technological University and a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE AP-S). He served as an Associate Editor of the IEEE Transactions on Antennas and Propagation. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012. He is a Fellow of IEEE.