商品描述
This book is a definitive guide to improving yield and reliability in the modern semiconductor industry. Blending academic research with industrial expertise, it unveils the innovative Build-In Reliability (BIR) platform. The book consists of 20 chapters, organized into four technical parts, deep diving into operational excellence and future perspectives. It emphasizes BIR's core components--Wafer-Level Reliability (WLR) and the AI-enhanced Build-In Reliability Diagnosis System (BIRDS), a knowledge-based tool designed to enable early detection of non-conformance. Part 1 introduces the BIR framework. Subsequent parts address completeness and timeliness, which are essential for establishing robust systems to enhance yield and reliability. Part 4 discusses emerging trends, including 3D packaging technologies (e.g., CoWoS), neural network-driven reliability predictions, Prognostic Health Management (PHM) for predictive maintenance, and the strategic importance of Diversity, Equity, and Inclusion (DEI) and globalization in overcoming industry challenges. This book covers a wide range of topics, including logic devices (down to 2nm), volatile and non-volatile memory tests, laboratory management, tool design, integrated circuit (IC) qualification, supplier and consumables management, statistical process control (SPC), and a novel multi-level quality and reliability training and certification framework. It also addresses the development of exceptionally reliable automotive chips, system-level lean methodologies, and optimization strategies, with a focus on yield-reliability and performance-cost trade-offs for value engineering. Complex concepts are elucidated through 51 real-world case studies, derived from decades of industry experience. These case studies emphasize root cause analysis, timely corrective actions, and innovative methodologies. Vivid figures, flowcharts, and tables are used extensively to enhance clarity and minimize reliance on complex mathematics. Each part concludes with 20 key takeaways to reinforce core insights. An indispensable resource for practitioners, researchers, and students, this book provides actionable strategies and advanced solutions for semiconductor manufacturing. It is the only comprehensive guide available today to bridge advanced academic research with real-world industrial applications in nanoelectronics manufacturing.
商品描述(中文翻譯)
本書是提升現代半導體產業產量和可靠性的權威指南。結合學術研究與產業專業知識，揭示了創新的內建可靠性（Build-In Reliability, BIR）平台。
本書共分為20章，組織成四個技術部分，深入探討運營卓越和未來展望。它強調BIR的核心組件——晶圓級可靠性（Wafer-Level Reliability, WLR）和AI增強的內建可靠性診斷系統（Build-In Reliability Diagnosis System, BIRDS），這是一個基於知識的工具，旨在實現不合格的早期檢測。
第一部分介紹了BIR框架。隨後的部分則探討了完整性和及時性，這對於建立強健系統以提升產量和可靠性至關重要。第四部分討論了新興趨勢，包括3D封裝技術（例如CoWoS）、基於神經網絡的可靠性預測、預測性維護的預測健康管理（Prognostic Health Management, PHM），以及多樣性、公平性和包容性（Diversity, Equity, and Inclusion, DEI）和全球化在克服產業挑戰中的戰略重要性。
本書涵蓋了廣泛的主題，包括邏輯元件（小至2nm）、揮發性和非揮發性記憶體測試、實驗室管理、工具設計、集成電路（Integrated Circuit, IC）認證、供應商和耗材管理、統計過程控制（Statistical Process Control, SPC），以及一個新穎的多層次質量和可靠性訓練與認證框架。它還探討了極其可靠的汽車晶片的開發、系統層級的精益方法論和優化策略，重點在於產量-可靠性和性能-成本的權衡，以實現價值工程。
複雜的概念通過51個真實案例研究進行闡明，這些案例源自數十年的行業經驗。這些案例強調了根本原因分析、及時的糾正措施和創新的方法論。生動的圖形、流程圖和表格被廣泛使用，以增強清晰度並減少對複雜數學的依賴。每個部分結尾都有20個關鍵要點，以加強核心見解。
本書是從業者、研究人員和學生不可或缺的資源，提供可行的策略和先進的解決方案，適用於半導體製造。它是目前唯一一本全面的指南，將先進的學術研究與納米電子製造中的實際工業應用相結合。
作者簡介
Dr. Wei-Ting Kary Chien has held positions with Intel, TSMC, STMicroelectronics, SMIC, and Centrillion Technologies as Q&R Head, Director/VP (Q&R), and General Manager in charge of technologies from IDM to Foundries, memory bio-chip, logic, and MEMS, managing quality and reliability of electronics from 2um to 2nm technologies. He has also served as an Adjunct Professor of Electrical Engineering at City University of Hong Kong as well as Electrical Engineering at Shanghai Jiaotong University. Dr. Chien has co-authored two technical books and holds more than 80 patents in US, Taiwan, and China. An IEEE Fellow, he has provided services to professional societies and technical journals in various capacities. Dr. Way Kuo is a Senior Fellow of Hong Kong Institute for Advanced Study, Emeritus President and University Distinguished Professor at City University of Hong Kong. He has held the endowed Wisenbaker Chair of Engineering in Innovation at Texas A&M University and served on the senior management team of Oak Ridge National Laboratory. A pioneer in designing reliability for electronics systems at the infant stage, he has been employed by Bell Labs and as a reliability consultant for IBM, TI, Motorola, and other high-tech companies. Dr. Kuo is a member of National Academy of Engineering and an IEEE Life Fellow. He has served as the Editor-in-Chief of IEEE Transactions on Reliability from 1999 to 2015.
作者簡介(中文翻譯)
簡偉廷博士曾在英特爾、台積電、意法半導體、中芯國際及Centrillion Technologies擔任Q&R負責人、總監/副總裁（Q&R）及總經理，負責從IDM到代工廠、記憶體生物晶片、邏輯電路及MEMS等技術的管理，並管理從2微米到2奈米技術的電子產品的品質與可靠性。他也曾擔任香港城市大學的電機工程兼任教授，以及上海交通大學的電機工程教授。 簡博士共同撰寫了兩本技術書籍，並在美國、台灣及中國擁有超過80項專利。他是IEEE Fellow，並在各種職位上為專業學會和技術期刊提供服務。 郭偉博士是香港高等研究院的高級研究員，香港城市大學的名譽校長及大學傑出教授。他曾在德州農工大學擔任創新工程的Wisenbaker講座教授，並在橡樹嶺國家實驗室的高層管理團隊中任職。作為電子系統可靠性設計的先驅，他曾在貝爾實驗室工作，並擔任IBM、德州儀器、摩托羅拉及其他高科技公司的可靠性顧問。 郭博士是美國國家工程院的成員及IEEE終身會士。他曾於1999年至2015年擔任IEEE Transactions on Reliability的主編。
