Semiconductor Manufacturing Handbook

Hwaiyu Geng

  • 出版商: McGraw-Hill Education
  • 出版日期: 2005-05-01
  • 售價: $5,070
  • 貴賓價: 9.5$4,817
  • 語言: 英文
  • 頁數: 800
  • 裝訂: Hardcover
  • ISBN: 0071445595
  • ISBN-13: 9780071445597
  • 相關分類: 半導體

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商品描述

Description:

This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.

 

 

Table of Contents:

PART 1: Semiconductor Fundamentals and Basic Materials

OARD OF REVIEWERS

CONTRIBUTORS

PREFACE

ACKNOWLEDGMENTS

Chapter 1: How Semiconductor Chips Are Made - Hwaiyu Geng, Lin Zhou

Chapter 2: IC Design - Ilsun Park

Chapter 3: Silicon Substrates for Semiconductor Manufacturing - K.V. Ravi

Chapter 4: Copper, Low-k Dielectrics, and Their Reliability - Hazara S. Rathore, Kaushik Chanda

Chapter 5: Fundamentals-Silicide Formation on Si - L.P. Ren, King N. Tu

Chapter 6: Plasma Process Control - David J. Coumou

Chapter 7: Vacuum Technology - Peter Biltoft Charles Howard

PART 2: Wafer Processing

Chapter 9: Microlithography - Chris A. Mack

Chapter 10: Ion Implanation and Rapid Thermal Processing - Michael Graf

Chapter 11: Wet Etching - Peng Zhang

Chapter 12: Plasma Etching - Shouliang Lai

Chapter 13: Physical Vapor Deposition - Florian Solzbacher

Chapter 14: Chemical Vapor Deposition - Edward J. McInerney

Chapter 15: Epitaxy - Jamal Ramdani, Giovanni Vaccari

Chapter 16: ECD Fundamentals - Tom Ritzdorf, John Klocks

Chapter 17: Chemical Mechanical Planarization - Timothy S. Dyer

Chapter 18: Wet Cleaning - Andrew Machamer

Part 3: Final Manufacturing

Chapter 19: Inspection, Measurement, and Test - Donald W. Blair

Chapter 20: Grinding, Stress Relief, and Dicing - Kazuhisa Arai, Yoshikazu Kobayashi, Hideaki Otani

Chapter 21: Packaging - Dietrich Tonnies, Michael Topper

Part 4: Nanotechnology, MEMS, and FPD

Chapter 22: Nanotechnology and Nanomanufacturing - Zhong L. Wang

Chapter 23: Fundamentals of Microelectromechanical Systems - Michael A. Huff

Chapter 24: Flat-Panel Display Technology and Manufacturing - David N. Liu

Part 5: Gases and Chemicals

Chapter 25: Specialty Gas and CDA Systems - Wayne D. Curcie

Chapter 26: Waste Gas Abatement Systems - Joseph D. Sweeney

Chapter 27: PFC Abatement - James C. Cox

Chapter 28: Chemical and Slurry Handling Systems - Kristin Cavicchi, Dan Barsness

Chapter 29: Fluid Handling Components for High Purity Liquid Chemicals and Slurries - Charles K. Gould

Chapter 30: Fundamentals of Ultrapure Water - David J. Albrecht

Part 6: Fab Yield, Operations, and Facilities

Chapter 31: Yield Management - Bo Li, Wayne Carriker

Chapter 32: Automated Material Handling System - Clint Harris

Chapter 33: CD Metrology and CD-SEM - Ram Peltinov, Mina Menaker

Chapter 34: Six Sigma - Bruno Scibilia, Yoan Dupret

Chapter 35: Advanced Process Control - Robert H. McCafferty

Chapter 36: Environmental, Health, and Safety (EHS) Considerations in Semiconductor Fabrication Facilities - Brett J. Davis, Steven R. Trammell

Chapter 37: Plan, Design, and Construction of a FAB - Industrial Design and Construction

Chapter 38: Cleanroom Design and Construction - Richard V. Pavlotsky, Stephen C. Beck

Chapter 39: Micro-Vibration and Noise Design - Michael Gandreau, Hal Amick

Chapter 40: ESD Controls in Cleanroom Environments - Larry Levit

Chapter 41: Airborne Molecular Contamination - Chris Muller

Chapter 42: Particle Monitoring in Semiconductor Manufacturing - Steven Kochevar, Jerry Gromala

Chapter 43: Wastewater Neutralization Systems - Richard E. Pinkowski

APPENDIX

INDEX