Testing of Interposer-Based 2.5D Integrated Circuits

Ran Wang, Krishnendu Chakrabarty

  • 出版商: Springer
  • 出版日期: 2017-03-21
  • 售價: $5,453
  • 貴賓價: 9.5$5,180
  • 語言: 英文
  • 頁數: 182
  • 裝訂: Hardcover
  • ISBN: 3319547135
  • ISBN-13: 9783319547138

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商品描述

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits.  The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.  This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.