3D IC Stacking Technology (Hardcover)
Banqiu Wu, Ajay Kumar , Sesh Ramaswami
- 出版商: McGraw-Hill Education
- 出版日期: 2011-07-28
- 售價: $2,500
- 貴賓價: 9.8 折 $2,450
- 語言: 英文
- 頁數: 544
- 裝訂: Hardcover
- ISBN: 007174195X
- ISBN-13: 9780071741958
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相關分類:
3D 列印、半導體
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商品描述
<內容簡介>
The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.
3D IC Stacking Technology covers:
- High density through silicon stacking (TSS) technology
- Practical design ecosystem for heterogeneous 3D IC products
- Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
- Process integration for TSV manufacturing
- High-aspect-ratio silicon etch for TSV
- Dielectric deposition for TSV
- Barrier and seed deposition
- Copper electrodeposition for TSV
- Chemical mechanical polishing for TSV applications
- Temporary and permanent bonding
- Assembly and test aspects of TSV technology
商品描述(中文翻譯)
最新的三維積體電路堆疊技術
以工業應用為重點,《3D IC Stacking Technology》全面介紹了三維元件整合的設計、測試和製造處理方法。這本權威指南的每一章都由業界專家撰寫,詳細介紹了不同的製造步驟。同時也討論了未來的工業應用和尖端設計潛力。這是半導體工程師和便攜式設備設計師的必備資源。
《3D IC Stacking Technology》內容包括:
- 高密度矽堆疊(TSS)技術
- 異質3D IC產品的實用設計生態系統
- 基於通過矽通孔(TSV)的3D IC堆疊的設計自動化和TCAD工具解決方案
- TSV製造的工藝整合
- TSV的高長寬比矽蝕刻
- TSV的介電層沉積
- 障礙層和種子層沉積
- TSV的銅電鍍
- TSV應用的化學機械拋光
- TSV技術的臨時和永久黏合
- TSV技術的組裝和測試方面