3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

  • 出版商: Springer
  • 出版日期: 2018-05-29
  • 售價: $4,446
  • 貴賓價: 9.5$4,224
  • 語言: 英文
  • 頁數: 339
  • 裝訂: Paperback
  • ISBN: 3319793055
  • ISBN-13: 9783319793054

下單後立即進貨 (1週~2週)

相關活動主題

20181101 1111 small

商品描述

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.